Technical Program Specialist

Silicon Box Inc; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Silicon Box Inc. is seeking a Technical Program Specialist to oversee customers’ technical projects and related matters from initiation to delivery.

The role involves close collaboration with account management and the sales team to tailor technical solutions and support profitability for customers. Ideal candidates have 2–3 years of hands-on experience in semiconductor back-end assembly, wafer bumping or WLCSP packaging, and a strong grasp of DOE, FMEA, and reliability concepts.

Qualifications

• Bachelor’s Degree in engineering (any discipline).
• 2–3 years of experience in assembly process of semiconductor back-end.
• Experience in wafer-level packaging such as wafer bumping, eWLB or fanout packaging.
• Knowledge of DOE, reliability requirements, material selection, FMEA, Failure Analysis.
• Strong communication and organization; able to work independently and with others.

Responsibilities

• Collaborate with account management and customer service on technical aspects of engagements.
• Provide technical support to sales to gain market share and improve profitability.
• Communicate customer technology requirements to internal teams and manage roadmaps.
• Coordinate factory/customer technical projects and act as the point of contact for quality/reliability programs.
• Implement change notices and resolve technical issues.
• Prepare and participate in audits and factory visits with customers.
• Perform other ad‑hoc activities as directed by management.

Skills

Communication

Problem solving

Organizational skills

Team player

Self-driven

Customer support

Education

Bachelor's degree in engineering

Tools

DOE

FMEA

Reliability tools

SAP/ERP systems

Job description

The Technical Program Specialist is responsible for overall management of customers’ technical projects and related matters.

Candidates with wafer bumping, WLCSP, or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• Works with account management and customer service teams in all technical aspects of the customers’ engagements
• Provides technical support to sales team to gain market share and improve customer’s profitability status.
• Communicates new customer technology requirements to the internal teams. Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and act as the point of contact for new quality/reliability programs.
• Implements change notices and resolves technical issues.
• Prepares and participates in audits and factory visits with customers.
• Other ad-hoc activities assigned by the management.

Requirements

• At least a Bachelor’s Degree in any engineering discipline.
• At least 2 - 3 years of relevant working experience in the assembly process of the back end of semiconductor production.
• Possess good knowledge and hands‑on experience in assembly processes especially in wafer‑level packaging like wafer bumping, eWLB or other wafer‑level Fanout Packaging.
• Knowledge on DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools.
• Self-driven and has excellent problem resolution and organizational skills for daily customer support and managing on‑going and future programs.
• Has initiative and demonstrate excellent follow‑up on active programs with multiple customers.
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and cross‑functional teams within the organization.
• Familiarity with SAP or other ERP systems is an added advantage.