Program Manager (Semiconductor)

KERRY CONSULTING PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Kerry Consulting Pte. Ltd. is assisting in recruiting a Program Manager (Semiconductor) in Singapore.

The role focuses on supporting customer programs across advanced packaging and manufacturing, driving cross-functional collaboration from qualification through ramp and ensuring timely follow-up on actions. The successful candidate will coordinate Engineering, Quality, Manufacturing and commercial teams, translate customer requirements into internal actions, and manage risks, milestones and

Qualifications

• Degree in Engineering or related discipline.
• Strong stakeholder management and cross-functional collaboration.
• Excellent communication and customer-facing skills.

Responsibilities

• Manage customer programs from qualification through production ramp.
• Coordinate Engineering, Quality, Manufacturing and commercial teams.
• Translate customer technical requirements into internal actions.
• Track milestones, risks, technical issues and change requirements.
• Support qualification, reliability, audits and customer reviews.
• Drive issue resolution and ensure timely follow-up across multiple programs.

Skills

Project coordination

Stakeholder management

Customer-facing

Communication

Education

Engineering degree

Job description

Program Manager (Semiconductor)

Our client is an established semiconductor manufacturer in Singapore and is looking to appoint a Program Manager to support customer programs across advanced packaging and manufacturing.

Key Responsibilities

• Manage customer programs from qualification through production ramp
• Coordinate Engineering, Quality, Manufacturing and commercial teams
• Translate customer technical requirements into internal actions
• Track milestones, risks, technical issues and change requirements
• Support qualification, reliability, audits and customer reviews
• Drive issue resolution and ensure timely follow-up across multiple programs

Key Requirements

• Degree in Engineering or related discipline
• 5+ years' experience in semiconductor manufacturing, backend assembly or advanced packaging
• Exposure to WLCSP, wafer bumping, Cu pillar, fan-out or related packaging technologies
• Experience in NPI, qualification, technology transfer or production ramp
• Familiar with DOE, FMEA, SPC, reliability and failure analysis
• Strong customer-facing, project coordination and stakeholder-management skills