Technical Program Lead - Semiconductor Packaging

Silicon Box Inc; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Silicon Box Inc. is seeking a Technical Program Specialist to oversee customers’ technical projects and related matters from initiation to delivery.

The role involves close collaboration with account management and the sales team to tailor technical solutions and support profitability for customers. Ideal candidates have 2–3 years of hands-on experience in semiconductor back-end assembly, wafer bumping or WLCSP packaging, and a strong grasp of DOE, FMEA, and reliability concepts.

Qualifications

• Bachelor’s Degree in engineering (any discipline).
• 2–3 years of experience in assembly process of semiconductor back-end.
• Experience in wafer-level packaging such as wafer bumping, eWLB or fanout packaging.
• Knowledge of DOE, reliability requirements, material selection, FMEA, Failure Analysis.
• Strong communication and organization; able to work independently and with others.

Responsibilities

• Collaborate with account management and customer service on technical aspects of engagements.
• Provide technical support to sales to gain market share and improve profitability.
• Communicate customer technology requirements to internal teams and manage roadmaps.
• Coordinate factory/customer technical projects and act as the point of contact for quality/reliability programs.
• Implement change notices and resolve technical issues.
• Prepare and participate in audits and factory visits with customers.
• Perform other ad‑hoc activities as directed by management.

Skills

Communication

Problem solving

Organizational skills

Team player

Self-driven

Customer support

Education

Bachelor's degree in engineering

Tools

DOE

FMEA

Reliability tools

SAP/ERP systems

Job description

Silicon Box Inc. is seeking a Technical Program Specialist to oversee customers’ technical projects and related matters from initiation to delivery.

The role involves close collaboration with account management and the sales team to tailor technical solutions and support profitability for customers. Ideal candidates have 2–3 years of hands-on experience in semiconductor back-end assembly, wafer bumping or WLCSP packaging, and a strong grasp of DOE, FMEA, and reliability concepts.