Senior Manager, Wafer Bumping R&D

UTAC HEADQUARTERS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

UTAC HEADQUARTERS PTE. LTD. seeks a seasoned Technical Project Leader to drive cross-functional wafer bumping programs in Singapore.

You will ensure on-time, on-budget development from concept to pre-production, while collaborating with customers and suppliers. This role demands strong leadership, deep process knowledge (PVD, Lithography, Plating, Ball drop, WLCSP), and the ability to translate requirements into robust execution plans and data-driven decisions to boost the company’s

Qualifications

• Bachelor's degree in electronics, mechatronics, or related field.
• 10+ years in Wafer Bumping Process Development.
• Proficient in PVD, Lithography, Plating, Ball drop and WLCSP backend.
• Strong analytical and data analysis capabilities.
• Proven leadership in cross-functional projects.

Responsibilities

• Lead cross-functional teams to deliver wafer bumping programs.
• Oversee development from schedule to pre-production.
• Coordinate with customers and suppliers on processes and equipment.
• Provide technical guidance to enable technology offload and meet specs.
• Drive department goals and strategy with coaching and problem solving.

Skills

Leadership

Analytical skills

Communication

Failure analysis

Data analysis tools

Cross-functional collaboration

Education

Bachelor's degree in Electronics/Mechatronics/Engineering/Materials science

Tools

PVD

Lithography

Plating

Ball drop

WLCSP backend

Job description

Responsibilities:

• Technical project leader with cross functional team.
• Oversee new product development per required schedule and budget.
• Ensure smooth project execution till pre-production stage.
• Work closely and independently with internal/external customers and suppliers to evaluate new enabling process, materials and equipment through regular progress and status update.
• Enable technology offload to assembly and ensure system requirements and customers' needs are met.
• Provide technical advice and consultation to secure business & strengthen competitiveness. Contribute actively to promoting the company's technological capability through customers' presentation.
• Set, align and drive goals and strategies of department. Identify and propose new package and process development for the Company's roadmap.
• Manage resources efficiently to fulfil project/ program requirements as well as overall group performance and synergy. Provide coaching and non-technical assistance to remove barriers/ obstacles to achieve department goals.

Requirements:

• Minimum a Bachelor's degree in Electronics, Mechatronics, Engineering, Material science or any related semiconductor manufacturing discipline.
• At least 10 years' experience in Wafer Bumping Process Development.
• Proficient in wafer bumping processes, including PVD, Lithography, Plating, Ball drop and WLCSP backend processes.
• Strong analytical skills with hands-on experience in failure analysis and data analysis tools.
• Proven leadership capability in driving new projects and technologies from planning and design through qualification and production ramp-up, in collaboration with cross functional teams.
• Excellent communication skills with the ability to effectively engage both internal and external stakeholders.
• Knowledge of Fan Out technology and assembly process is an added advantage.