Senior Advanced Packaging Engineer (TCB / Semiconductor)

The Supreme HR Advisory Pte. Ltd.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is seeking a Senior Advanced Packaging Engineer to lead advanced packaging activities in Singapore.

You will work on Thermo Compression Bonding, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration, coordinating with customers and internal teams. Responsibilities include developing packaging processes, validating equipment, supporting customer discussions, and driving yield and reliability improvements.

Qualifications

• Bachelor's or Master's degree in a relevant engineering discipline.
• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on with TCB, advanced packaging, flip chip, NPI, process/ equipment qualification.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration.
• Evaluate bond force, temperature profiles, process windows, alignment accuracy, and package warpage for yield and reliability.
• Provide guidance throughout equipment development and act as internal customer for machine qualification.
• Monitor industry developments in advanced packaging technologies and semiconductor trends.

Skills

TCB knowledge

Advanced packaging

Chiplet integration

NPI

Process qualification

Equipment qualification

Yield improvement

Reliability testing

Thermal management

Education

Bachelor's or Master's in Engineering fields

Materials Engineering

Mechanical Engineering

Electrical/Chemical Engineering

Physics/Semiconductor Engineering

Tools

ASMPT

BESI

Toray

Panasonic

Kulicke & Soffa

Job description

Position title : Senior Advanced Packaging Engineer (TCB / Semiconductor)

• Location: Admirax St

• Working Days: 5 Day A Week

• Working hours : 9:00am - 6:00pm

• Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.

• Translate process requirements into equipment specifications.

• Participate in customer technical discussions and application reviews.

• Support technical sales activities and customer demonstrations.

• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)

• Flip Chip Assembly

• Hybrid Bonding

• HBM Packaging

• CoWoS

• CoPoS

• 2.5D Packaging

• 3D Packaging

• Chiplet Integration

• Large Die Packaging

- Evaluate and optimize:

• Bond force

• Temperature profiles

• Process windows

• Alignment accuracy

• Package warpage

• Yield

• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture

• Functional specifications

• Accuracy requirements

• Throughput targets

• Thermal performance

• Bonding process capability

• Reliability requirements

• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria

• Process qualification

• FAT and SAT support

• Customer buyoff support

• Qualification reporting

• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies

• Semiconductor manufacturing trends

• Customer requirements

• Competitor equipment

• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements

- Bachelor's or Master's Degree in:

• Materials Engineering

• Mechanical Engineering

• Electrical Engineering

• Chemical Engineering

• Physics

• Semiconductor Engineering

• Related Engineering disciplines

- Minimum 5 years experience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)

• Advanced Packaging Process Development

• Flip Chip Assembly

• New Product Introduction (NPI)

• Process Qualification

• Equipment Qualification

• Manufacturing Engineering

• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM

• CoWoS

• CoPoS

• Chiplets

• 2.5D Packaging

• 3D Packaging

• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)

• Semiconductor Packaging

• Flip Chip Assembly

• Process Qualification

• SPC

• DOE

• Yield Improvement

• Reliability Testing

• Failure Analysis

• Package Warpage

• Thermal Management

• Alignment Accuracy

• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.