Senior Packaging Engineer – MEMS/WLCSP, Bonus & Equity

SiTime Corp.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Benefits offered by this job

Quarterly bonus

Equity grants

Job summary

SiTime in Singapore is seeking a hands-on Packaging Process Engineer to develop, optimize, and sustain advanced packaging processes for WLCSP, bumping and RDL. You will drive process improvements and support high-yield manufacturing in a dynamic semiconductor environment.

Collaborate with R&D, design, equipment and production teams; apply Cp/Cpk, SPC, SOPs, and training to operators. You will stay current with packaging technologies and contribute to NPI and roadmap execution.

Qualifications

• Experience in packaging processes for WLCSP technologies.
• Knowledge of Cp/Cpk and SPC methods.
• Ability to collaborate with R&D, design, equipment and manufacturing teams.

Responsibilities

• Develop, optimize and characterize packaging processes for WLCSP, including bumping and RDL formation.
• Conduct root cause analysis and implement corrective actions using 8D methodology.
• Support NPI and process improvement projects with cross-functional teams.

Skills

Process optimization

Materials knowledge

GMP compliance

Job description

SiTime in Singapore is seeking a hands-on Packaging Process Engineer to develop, optimize, and sustain advanced packaging processes for WLCSP, bumping and RDL. You will drive process improvements and support high-yield manufacturing in a dynamic semiconductor environment.

Collaborate with R&D, design, equipment and production teams; apply Cp/Cpk, SPC, SOPs, and training to operators. You will stay current with packaging technologies and contribute to NPI and roadmap execution.