Technical Program Manager: NPI & Semiconductor Manufacturing

Citadel Search; Singapore; On-site; SGD 120,000 - 200,000; Full time

Job summary

Citadel Search is seeking an experienced Technical Program Manager to lead multi-disciplinary engineering programs in a high-tech manufacturing environment. You will drive New Product Introduction (NPI), factory bring-up, and process optimisation across the full lifecycle from prototype to high-volume manufacturing.

The role requires strong leadership, cross‑functional coordination, and hands‑on knowledge of semiconductor packaging processes to deliver robust NPI handoffs and continuous

Qualifications

• Bachelor’s degree in Mechanical, Electrical or Manufacturing Engineering.
• 8+ years in electronics, semiconductor, or optical module manufacturing.
• 5+ years in technical program management within high-volume environments.
• Experience with optical module or datacom manufacturing preferred.
• Strong risk identification and mitigation for supply, equipment, and dependencies.

Responsibilities

• Lead the full technical program lifecycle for new product introductions in a manufacturing facility.
• Coordinate milestones across design, process engineering and production teams.
• Apply hands-on knowledge of semiconductor packaging processes to translate specs into manufacturing flows.
• Mitigate cross-functional risks and ensure timely NPI handoffs to the factory floor.
• Improve FPY and investigate root causes of manufacturing failures.
• Define and improve engineering development processes, metrics, and dashboards.

Skills

Leadership

Cross-functional coordination

Stakeholder management

Communication

Education

Bachelor’s degree in Mechanical/Electrical/Manufacturing Engineering

Job description

Citadel Search is seeking an experienced Technical Program Manager to lead multi-disciplinary engineering programs in a high-tech manufacturing environment. You will drive New Product Introduction (NPI), factory bring-up, and process optimisation across the full lifecycle from prototype to high-volume manufacturing.

The role requires strong leadership, cross‑functional coordination, and hands‑on knowledge of semiconductor packaging processes to deliver robust NPI handoffs and continuous