Application Director (Advanced Semiconductor Packaging)

Achieve Group; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Achieve Group in Singapore seeks a senior leader to drive semiconductor equipment applications and lead customer-facing teams across process integration. You will translate customer needs into tool specifications and oversee test vehicles, acceptance criteria and demos.

With hands-on advanced packaging experience (hybrid bonding, D2W/W2W, TCB or flip-chip) and deep overlay/alignment knowledge, you will optimize yield and uptime while coordinating with Engineering and Quality teams on field data

Qualifications

• MS or PhD in materials science, chemical, electrical, mechanical or optical engineering, or physics.
• 12+ years in semiconductor equipment applications, process or field engineering, including 5+ years leading customer-facing teams.
• Hands-on advanced packaging experience: hybrid bonding, D2W or W2W, TCB or flip-chip.
• Process-level command of overlay data and alignment-mark performance.
• Led new-tool install and acceptance at a fab or OSAT.
• Strong in DOE, SPC, gauge R&R, and defect and yield analysis.
• Able to engage customer engineering leadership credibly.

Responsibilities

• Lead applications, process integration, field service and on-site customer engineers.
• Turn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specifications.
• Define test vehicles, alignment-mark requirements and acceptance criteria with customers and Engineering.
• Run customer demos and evaluations; diagnose overlay, die shift, void and bond-strength issues.
• Advise customers on mark design, layout and process changes that improve alignment and bond yield.
• Integrate the bonder with upstream and downstream steps: CMP, clean, plasma activation, anneal and metrology.
• Lead tool install and site acceptance; track uptime, MTBF and overlay stability, and feed field data back to Engineering and Quality.
• Build field service processes: install, escalation, spares and training.
• Support Sales with technical selling, benchmarks and roadmap input.

Skills

Customer leadership

Technical communication

Problem solving

Education

MS or PhD in engineering/physics

Tools

DOE

SPC

Gauge R&R

Job description

• Lead applications, process integration, field service and on-site customer engineers


• Turn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specifications


• Define test vehicles, alignment-mark requirements and acceptance criteria with customers and Engineering


• Run customer demos and evaluations; diagnose overlay, die shift, void and bond-strength issues


• Advise customers on mark design, layout and process changes that improve alignment and bond yield


• Integrate the bonder with upstream and downstream steps: CMP, clean, plasma activation, anneal and metrology


• Lead tool install and site acceptance; track uptime, MTBF and overlay stability, and feed field data back to Engineering and Quality


• Build field service processes: install, escalation, spares and training


• Support Sales with technical selling, benchmarks and roadmap input

What you bring

• MS or PhD in materials science, chemical, electrical, mechanical or optical engineering, or physics


• 12+ years in semiconductor equipment applications, process or field engineering, including 5+ years leading customer-facing teams


• Hands-on advanced packaging experience: hybrid bonding, D2W or W2W, TCB or flip-chip


• Process-level command of overlay data and alignment-mark performance


• Led new-tool install and acceptance at a fab or OSAT


• Strong in DOE, SPC, gauge R&R, and defect and yield analysis


• Able to engage customer engineering leadership credibly

Good to have

• Relationships with advanced packaging teams at foundries, IDMs or OSATs


• Experience building a field service organisation from scratch


• Familiarity with SEMI S2/S8 and fab facility requirements

We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.