Technical Director, Advanced Packaging Integration

WhiteCrow Research Pvt. Ltd.; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

WhiteCrow Research Pvt. Ltd. seeks a Technical Director, Advanced Packaging Integration for a global materials engineering leader. You will lead cross‑functional teams, define end‑to‑end packaging processes, and guide development across lithography, etch, and thin films to meet customer roadmaps.

You will manage complex experiments, analyze data, and present findings to executives, while mentoring engineers and driving customer partnerships across time zones.

Qualifications

• Master’s or PhD with relevant field and years of experience.
• Deep hands‑on experience with advanced 2.xD packaging technologies.
• Strong communication and leadership across geographies.

Responsibilities

• Lead cross‑functional efforts to develop next‑gen 2.xD packaging concepts.
• Define end‑to‑end process flows for packaging technologies.
• Collaborate with customers to align process specifications and acceptance criteria.
• Mentor early‑career engineers and provide technical direction.
• Publish and present technical findings at industry venues.

Skills

Cross‑functional leadership

Executive communication

Data analysis

Problem solving

Education

Master’s degree in Electrical Engineering

PhD in Electrical Engineering or related field

Tools

FOPLP

Organic interposer

Substrate packaging

Wafer‑level back‑end

Job description

We are global talent research, insight and pipelining specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client’s in‑house research.

About our client

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next‑generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

As a Technical Director, Advanced Packaging Integration, you will be responsible for...

• Leading cross‑functional efforts to develop and enable next‑generation 2.xD packaging concepts, architectures, and technologies
• Defining, documenting, and implementing end‑to‑end process flows for panel‑level packaging technologies
• Leading material selection, characterization, and compatibility assessments for large form factor substrates
• Partnering with customers to define and align process specifications and acceptance criteria
• Collaborating with business units on process development (lithography, etch, thin films, etc.), module co‑optimization, and technology transfer to customers
• Contributing to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps
• Analyzing process data to identify trends, drive optimization, and improve performance
• Conducting root‑cause analyses of defects and implement corrective actions to improve yield and reliability
• Within established safety guidelines, designing and executing complex engineering experiments; collecting and analyzing data; and delivering rigorous reports with innovative, practical solutions
• Publishing and presenting technical findings at leading industry conferences and in peer‑reviewed journals
• Mentoring and guiding early‑career engineers; providing technical direction and best practices.

What you already have...

• Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• In‑depth knowledge and hands‑on experience with advanced 2.xD packaging technologies such as fan‑out panel‑level packaging (FOPLP), (organic) interposer, substrate and wafer‑level back‑end technologies and related process flows
• Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel‑level
• Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade‑offs
• Proficiency in statistical data analysis (e.g. DoE, JMP)
• Knowledge of industry standards and best practices in semiconductor packaging
• Solid understanding of process characterization, metrology, materials & failure analysis
• Working knowledge of reliability requirements and qualification methodologies
• Proven capability to lead multi‑functional teams to resolve complex technical problems
• Exceptional written and verbal communication skills
• Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts
• Drive structured technical discussions with customers and suppliers
• Articulate positions, influence decisions, and align technical direction
• Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications
• Ability to work effectively across geographies and time zones