Senior Quantum 3D Integration and Packaging Engineer

WhiteCrow Research Pvt. Ltd.; Singapore; On-site; SGD 180,000 - 230,000; Full time

Job summary

WhiteCrow Research Pvt. Ltd. is partnering with a global leader in materials engineering solutions to recruit a Senior Quantum 3D Integration and Packaging Engineer in Singapore.

You will design 3D integration and packaging solutions for quantum structures, collaborating with packaging, process, hardware, and metrology teams to advance technology. The ideal candidate holds a PhD/Master’s/Bachelor’s in a related field with 5+ years in advanced packaging and deep knowledge of wafer-level

Qualifications

• PhD, Master’s or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or related field.
• Minimum 5 years in advanced packaging, 3D/heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip and related packaging technologies.
• Hands-on semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.

Responsibilities

• Creating 3D integration and packaging solutions for different platforms and quantum structures.
• Working with advanced packaging, process, hardware, and metrology teams to develop new materials, processes, and structures for quantum devices.
• Designing, collecting data, analyzing and compiling reports on a variety of difficult process engineering experiments, within safety guidelines.
• Troubleshooting a variety of complex problems, performing Root Cause Analysis and resolving a variety of difficult process engineering issues.
• Generating internal and external documentation for products, presentations and technical reports.
• Designing and conducting experiments, measuring material and device properties and interpret data.
• Keeping up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies.
• Collaborating with customers, startups, or universities to identify key problems and develop enabling solutions.

Skills

Problem-solving

Technical communication

Cross-functional collaboration

Education

PhD/Master's/Bachelor's in relevant field

Tools

Wafer-level packaging

Hybrid bonding

TSV

Chiplets

Flip-chip

Metrology

Job description

We are global talent research, insight and pipelining specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client’s in-house research.

About our client

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

As a Senior Quantum 3D Integration and Packaging Engineer, you will be responsible for...

• Creating 3D integration and packaging solutions for different platforms and quantum structures
• Working with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices
• Designing, collecting data, analyzing and compiling reports on a variety of difficult process engineering experiments, within safety guidelines
• Troubleshooting a variety of complex problems, performing Root Cause Analysis and resolving a variety of difficult process engineering issues
• Generating internal and external documentation for products, presentations and technical reports
• Designing and conducting experiment, measuring material and device properties and interpret data
• Keeping up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies
• Collaborating with customers, start-ups, or universities to identify key problems and develop enabling solutions.

What you already have...

• PhD, Master's, or Bachelor's degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.
• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.
• Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.
• Strong problem-solving, technical communication, and cross-functional collaboration skills.
• Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams.