Principal Research Engineer, Adv Pckg, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 300,000 - 460,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a results-oriented leader to steer platform technology integration in Advanced Packaging. The role focuses on defining a medium-to-long term process capability roadmap and developing 2.5D TSV interposers, integrating optics with electronics via advanced bonding technologies for high-performance networking interconnects.

You will build and mentor a high-performing team, manage cross-functional projects, engage industry

Qualifications

• Bachelor or Master’s degree required in a relevant engineering/science field.
• 15 years of experience in semiconductor industry with expertise in device fabrication and advanced packaging technologies.
• Broad knowledge of lithography, etch, diffusion/thin films, electroplating, CMP, bonding.
• Strong understanding of process development cycles and manufacturing scalability.
• Proven leadership, people management and strategic thinking skills.
• Experience working in a matrixed environment with cross-functional collaboration.

Responsibilities

• Evaluate industry trends and define differentiated platform technology architectures to gain competitive advantage.
• Define simple, cost-effective process flows to realise platform architectures.
• Identify technology gaps and set clear specifications for process modules and accountability for delivery.
• Lead multi-disciplinary teams of designers, integrators, and fabrication partners to realise architectures.
• Engage industry customers from proof of concept to prototyping and manufacturing.
• Act as project leader for industry, consortium, and internal capability projects.
• Mentor and retain a high-performing team and foster innovation across departments.

Skills

Leadership

Project management

Strategic thinking

Team building

Communication

Education

Bachelor or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related field

Job description

Job Description

We are seeking a results-oriented leader for platform technology integration in Advanced Packaging department developing system-in-package at wafer level. The candidate will be responsible for defining the medium-to-long term process capability roadmap to support packaging platform technologies, developing 2.5D TSV interposers, and integrating optics with electronics using highly scaled u-bump and hybrid bond technologies for networking and high-performance computing interconnects.

Key Responsibilities

• Evaluate industry trends and define differentiated platform technology architectures to obtain competitive advantage.
• Define simplest process flow with minimum number of process steps to realise platform technology architectures at lowest cost.
• Identify technology gaps and weak links with clear specifications for process module and make process module accountable for timely delivery.
• Realise platform architectures by closely working with a team of designers, integrators, process module and fab.
• Engage industry customers from proof of concept to low volume prototyping/manufacturing.
• Act as a project leader for industry, consortium, and internal core capability projects.
• Act as an influencer in internal leadership and industry collaborations.
• Build, mentor, and retain a high-performing team to deliver impact.
• Foster a culture of agility, technical excellence, individual and team innovation, intra-/inter-department collaboration, and continuous improvement.
• Effectively manage research funding obtained through grant proposals, industry partnerships, and strategic collaborations.
• Able to manage resource allocation efficiently amid competing priorities.
• Establish clear goals, metrics, and milestones to evaluate progress on technology development initiatives.
• Ensure effective project management, documentation, and knowledge dissemination across multidisciplinary teams.

Requirements

• Bachelor or Masters degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or a related field.
• 15 years of experience in semiconductor industry, with expertise in device fabrication, Cu backend integration and exposure to advanced packaging technologies and managing projects and teams.
• Broad knowledge of multiple process technologies including lithography, etch, diffusion/thin films, electroplating, CMP, bonding.
• Strong understanding of considerations in process development cycle including early pathfinding and manufacturing scalability.
• Strong, hands-on people manager demonstrating excellent leadership, communication, and strategic thinking skills.
• Extensive experience working in a diverse, matrixed environment and collaborating across functions.