Senior /Lead Research Engineer (FOWLP/2.5D/3D package integration) (HI), IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 70,000 - 100,000; Full time

Benefits offered by this job

Access to state-of-the-art facilities

Opportunity for professional growth

Collaborative work environment

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a Scientist or Senior Scientist for their advanced Packaging Program. This role focuses on developing industry-leading packaging platform technologies such as 2.5D/3D IC and Co-packaged optics.

The successful candidate will work in a dynamic environment contributing to innovative research while collaborating with stakeholders to advance groundbreaking technologies. A solid background in semiconductor processes and project management will be essential.

Qualifications

• 5–10 years of experience in semiconductor with expertise in backend integration.
• Proven ability to work effectively in diverse, matrixed environments.
• Strong analytical and problem-solving skills.

Responsibilities

• Develop advanced packaging technology platforms Io technologies.
• Lead capability development for internal and external projects.
• Engage and manage internal and external stakeholders.

Skills

Hands-on experience with semiconductor technologies

Analytical/problem-solving skills

Collaboration skills

Communication abilities

Education

Bachelor's or Master's in Materials Science & Engineering, Mechanical, Chemical, Electronics, or related field

Tools

DOE and SPC tools (JMP/Minitab)

Advanced process integration approaches

Job description

Job Description

The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art advanced packaging platform technologies, such as 2.5D/3D IC and Co‑packaged optics. Development of critical modules includes fine‑pitch multi‑layer redistribution layers (RDL), micro bumping, temporary bonding and debonding process flow, flip‑chip thermal compression bonding, chip‑to‑wafer and wafer‑to‑wafer fusion/hybrid bonding capabilities, developing fan‑out wafer‑level packaging, 2.5D interposer, and 3D chip stacking process integration flows for heterogeneous integration of chiplets.

The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external ecosystem stakeholders.

Key Responsibilities

• Develop advanced packaging technology platforms (fan‑out packaging, 2.5D interposer and 3D stacking) capabilities and novel process integration approaches for heterogeneous chiplets integration.
• Work with design and process module teams to establish design rules and PDK for advanced packaging technologies.
• Lead capability development projects for internal and external industry projects involving new materials, advanced process integration approaches, and new test vehicle designs with minimum manageable risks.
• Engage and manage internal and external stakeholders for project activities execution and provide timely updates on schedule and deliverables.
• Act as a subject‑matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Collaborate with cross‑functional teams such as design, unit process team, yield improvement, and external partners, including materials, equipment, customers and universities, to identify technology gaps, define technology roadmap and drive the development.
• Inspire and mentor students in semiconductor technology, contributing to workforce development in advanced packaging.
• Customer/partner engagement: ability to present technical content to customers and senior stakeholders; drive joint development (JDP/NRE).
• Mentoring junior engineers, influencing without authority, and ownership of module roadmaps.
• Should be able to work hands‑on in the cleanroom and learn new processes and metrology equipment.

Job Requirements

• Bachelor's or Master's in Materials Science & Engineering, Mechanical, Chemical, Electronics/ Electrical & Computer Engineering, Physics, Chemistry or a closely related field.
• 5–10 years of experience in semiconductor experience with expertise in Cu backend integration and exposure to advanced packaging technologies (flip‑chip, FOWLP, 2.5D/3D, TSV, hybrid/fusion bonding).
• Broad hands‑on knowledge of one or more unit processes such as lithography, etch (damascene, TSV via‑last/middle); deposition (ALD/CVD/PVD, including high‑AR barrier and seed layers); electroplating and alternative via‑fill materials, CMP for hybrid bonding; fusion/hybrid bonding; wafer thinning; and dicing.
• Proven ability to work effectively in a diverse, matrixed environment and collaborate with cross‑functional departments.
• Strong analytical/problem‑solving skills (Ishikawa, Seven Basic Quality Tools, brainstorming) and proficiency with DOE and SPC (JMP/Minitab).
• NPI to HVM ramp experience: process window definition, control plans, and yield/cost improvement through pilot to high‑volume manufacturing (foundry/OSAT).
• Reliability & standards: working knowledge of JEDEC/IPC/JESD (e.g., HTS, TC, HAST, BLR, EM), and failure analysis flows (X‑ray, CSAM, FIB/SEM‑EDX).
• Excellent written and verbal communication abilities.
• Demonstrated ability to manage multiple projects and priorities in a research and translational environment.
• Able to work effectively with multi‑ethnic, multicultural teams and to build inclusive, high‑performing teams.

What We Offer

• The opportunity to work on cutting‑edge research projects in advanced packaging and heterogeneous integration.
• A collaborative & interdisciplinary work environment and access to state‑of‑the‑art facilities and resources.
• File intellectual property (IP) promptly for new research findings.
• Publish research in peer‑reviewed journals and present findings at international conferences.
• Researchers have access to advanced laboratories and characterisation equipment, fostering innovation and enabling the development of groundbreaking technologies. The institute encourages interdisciplinary collaboration and offers opportunities for professional growth and development.