Senior Advanced Packaging Engineer [ Semiconductor | Thermo Compression Bonding (TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip ] - 8890
THE SUPREME HR ADVISORY PTE. LTD.
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Job summary
THE SUPREME HR ADVISORY PTE. LTD. seeks a Senior Advanced Packaging Application Engineer (TCB) to drive thermo- compression bonding and advanced packaging applications.
The role emphasizes process development for 2.5D/3D packaging, HBM, CoWoS, and chiplet integration within a fast-paced semiconductor setting. You will interact with customers to translate requirements into equipment specs, support technical demonstrations, and lead qualification activities across multi-disciplinary teams in
Qualifications
- - Bachelor’s or Master’s degree in a technical field related to advanced packaging.
- - 5+ years of experience in semiconductor advanced packaging.
- - Hands-on experience with TCB or related packaging processes.
- - Experience with NPI, Process Qualification, and equipment qualification.
Responsibilities
- Understand customer packaging roadmaps and manufacturing requirements.
- Translate process requirements into equipment specifications.
- Participate in customer technical discussions and application reviews.
- Support technical sales activities and customer demonstrations.
- Gather customer feedback and recommend future product enhancements.
- Monitor industry developments in advanced packaging technologies and market trends.
Skills
Education
Tools
Job description
- Location: Admirax St
- Working Days: 5 Day A Week
- Working hours : 9:00am - 6:00pm
- Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)
- Understand customer packaging roadmaps and manufacturing requirements.
- Translate process requirements into equipment specifications.
- Participate in customer technical discussions and application reviews.
- Support technical sales activities and customer demonstrations.
- Gather customer feedback and recommend future product enhancements.
- Develop and support applications involving:
- Thermo Compression Bonding (TCB)
- Flip Chip Assembly
- Hybrid Bonding
- HBM Packaging
- CoWoS
- CoPoS
- 2.5D Packaging
- 3D Packaging
- Chiplet Integration
- Large Die Packaging
- Evaluate and optimize:
- Bond force
- Temperature profiles
- Process windows
- Alignment accuracy
- Package warpage
- Yield
- Reliability
- Work closely with multidisciplinary engineering teams to define:
- Machine architecture
- Functional specifications
- Accuracy requirements
- Throughput targets
- Thermal performance
- Bonding process capability
- Reliability requirements
- Customer acceptance criteria
- Provide technical guidance throughout equipment development.
- Serve as the internal customer during equipment development.
- Responsibilities include:
- Defining machine acceptance criteria
- Process qualification
- FAT and SAT support
- Customer buyoff support
- Qualification reporting
- Continuous performance improvement
- Monitor industry developments in:
- Advanced packaging technologies
- Semiconductor manufacturing trends
- Customer requirements
- Competitor equipment
- Emerging packaging architectures
- Support future product strategy and technology roadmap planning.
- Bachelor's or Master's Degree in:
- Materials Engineering
- Mechanical Engineering
- Electrical Engineering
- Chemical Engineering
- Physics
- Semiconductor Engineering
- Related Engineering disciplines
- Minimum5 yearsexperience in semiconductor advanced packaging.
- Hands-on experience in one or more of the following:
- Thermo Compression Bonding (TCB)
- Advanced Packaging Process Development
- Flip Chip Assembly
- New Product Introduction (NPI)
- Process Qualification
- Equipment Qualification
- Manufacturing Engineering
- Customer Process Development
- Experience supporting advanced package technologies such as:
- HBM
- CoWoS
- CoPoS
- Chiplets
- 2.5D Packaging
- 3D Packaging
- Large Die Packaging
- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.
- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.
- Strong understanding of:
- Thermo Compression Bonding (TCB)
- Semiconductor Packaging
- Flip Chip Assembly
- Process Qualification
- SPC
- DOE
- Yield Improvement
- Reliability Testing
- Failure Analysis
- Package Warpage
- Thermal Management
- Alignment Accuracy
- Semiconductor Manufacturing Processes
- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.
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