Director, Advanced Packaging Disruptive Technology

WhiteCrow Research; Singapore; On-site; SGD 160,000 - 210,000; Full time

Job summary

WhiteCrow Research is seeking a Director for Advanced Packaging Disruptive Technology to define a long-range roadmap and lead a world-class innovation team. You will drive concept incubation, feasibility studies, and partnerships with customers and ecosystem players to accelerate next-gen packaging capabilities.

The role requires strategic leadership, strong understanding of D2W, RDL, CoWoS, TSV, and a track record of translating technology trends into business impact.

Qualifications

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc).
• Proven experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.

Responsibilities

• Define and execute a long-range pathfinding roadmap for advanced packaging, identifying next inflection points.
• Drive concept incubation and feasibility exploration for disruptive packaging approaches.
• Evaluate emerging technology options and guide make/buy/partner decisions.
• Engage with customers to translate roadmaps into actionable development strategies.
• Build and lead a world-class innovation team and governance models.

Job description

About our client

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

As a Director, Advanced Packaging Disruptive Technology, you will be responsible for...

• Defining and executing a long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.
• Driving concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms, including novel interconnect schemes, heterogeneous integration architectures, and advanced substrate innovations.
• Evaluating emerging technology options and guiding make/buy/partner decisions to establish differentiated capabilities ahead of industry adoption cycles.
• Anticipating and defining technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.

Innovation Leadership & Team Building

• Building, leading, and inspiring a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.
• Instilling an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.
• Establishing structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.
• Mentoring technical leaders and creating a pipeline of innovation talent capable of sustaining long-term differentiation.

Customer & Market-Driven Innovation

• Translating customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.
• Engaging deeply with key customers to identify latent needs and unmet challenges not being addressed by current packaging solutions.
• Driving the creation of new product concepts and technology platforms that are delivering step-function improvements in performance, cost, power, and scalability.
• Positioning offerings to create clear value differentiation and long-term competitive advantage.

Ecosystem Development & Strategic Partnerships

• Building and leading a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.
• Identifying and activating disruptive partnerships that are accelerating innovation cycles and enabling early validation of emerging technologies.
• Driving joint development programs and consortium engagement to shape industry direction and standards.
• Establishing governance models for early-stage technology programs, balancing exploration with execution discipline.
• Driving alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.
• Developing executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.
• Ensuring learnings from early exploration are being captured, scaled, and leveraged across the organization.
• Visionary Technology Leader: Anticipating industry disruption and defining future-state architectures ahead of the market.
• Innovation Catalyst: Creating an environment where breakthrough ideas are being generated, tested, and scaled.
• Strategic Connector: Bridging customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.
• Builder of Teams & Culture: Attracting, developing, and retaining top talent while fostering collaboration and accountability.
• Decisive Change Agent: Operating effectively in ambiguity and making high-impact decisions with incomplete data.

What you already have...

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.
• Proven experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.