Technical Director, Advanced Packaging Integration

Applied Materials, Inc.; Singapore; On-site; SGD 140,000 - 210,000; Full time

Job summary

Applied Materials in Singapore is seeking a senior packaging engineer to lead cross-functional teams in developing next‑generation 2.xD packaging concepts, including fan-out panel-level packaging, interposers, and related processes. You will define end-to-end process flows, select materials, and collaborate with customers to align specifications.

The role requires a Master’s degree with 10 years or a PhD with 5 years in Electrical Engineering, Materials Science, or a related field, with deep

Qualifications

• Master’s degree with 10 years or PhD with 5 years in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
• Strong background in 2.xD packaging technologies such as FOPLP, interposer, substrate and wafer-level back-end technologies.

Responsibilities

• Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies.
• Define, document, and implement end-to-end process flows for panel-level packaging technologies.
• Lead material selection, characterization, and compatibility assessments for large form factor substrates.
• Partner with customers to define and align process specifications and acceptance criteria.
• Collaborate with business units on process development and technology transfer to customers.
• Analyze process data to identify trends, drive optimization, and improve performance.
• Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability.
• Publish and present technical findings at leading industry conferences and in peer-reviewed journals.
• Mentor and guide early-career engineers; provide technical direction and best practices.

Job description

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Location: Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Key Responsibilities

• Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies
• Define, document, and implement end-to-end process flows for panel-level packaging technologies
• Lead material selection, characterization, and compatibility assessments for large form factor substrates
• Partner with customers to define and align process specifications and acceptance criteria
• Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers
• Contribute to Applied’s equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps
• Analyze process data to identify trends, drive optimization, and improve performance
• Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability
• Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions
• Publish and present technical findings at leading industry conferences and in peer-reviewed journals
• Mentor and guide early-career engineers; provide technical direction and best practices

Requirements

• Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows
• Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level
• Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs
• Proficiency in statistical data analysis (e.g. DoE, JMP)
• Knowledge of industry standards and best practices in semiconductor packaging
• Solid understanding of process characterization, metrology, materials & failure analysis
• Working knowledge of reliability requirements and qualification methodologies
• Proven capability to lead multi-functional teams to resolve complex technical problems
• Exceptional written and verbal communication skills
• Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts
• Drive structured technical discussions with customers and suppliers
• Articulate positions, influence decisions, and align technical direction
• Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications
• Ability to work effectively across geographies and time zones

Additional Information

Time Type: Full time

Employee Type: Assignee / Regular

Travel: Relocation

Eligible: No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.