Technical Director – 2.xD Packaging Innovation

Applied Materials, Inc.; Singapore; On-site; SGD 140,000 - 210,000; Full time

Job summary

Applied Materials in Singapore is seeking a senior packaging engineer to lead cross-functional teams in developing next‑generation 2.xD packaging concepts, including fan-out panel-level packaging, interposers, and related processes. You will define end-to-end process flows, select materials, and collaborate with customers to align specifications.

The role requires a Master’s degree with 10 years or a PhD with 5 years in Electrical Engineering, Materials Science, or a related field, with deep

Qualifications

• Master’s degree with 10 years or PhD with 5 years in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
• Strong background in 2.xD packaging technologies such as FOPLP, interposer, substrate and wafer-level back-end technologies.

Responsibilities

• Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies.
• Define, document, and implement end-to-end process flows for panel-level packaging technologies.
• Lead material selection, characterization, and compatibility assessments for large form factor substrates.
• Partner with customers to define and align process specifications and acceptance criteria.
• Collaborate with business units on process development and technology transfer to customers.
• Analyze process data to identify trends, drive optimization, and improve performance.
• Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability.
• Publish and present technical findings at leading industry conferences and in peer-reviewed journals.
• Mentor and guide early-career engineers; provide technical direction and best practices.

Job description

Applied Materials in Singapore is seeking a senior packaging engineer to lead cross-functional teams in developing next‑generation 2.xD packaging concepts, including fan-out panel-level packaging, interposers, and related processes. You will define end-to-end process flows, select materials, and collaborate with customers to align specifications.

The role requires a Master’s degree with 10 years or a PhD with 5 years in Electrical Engineering, Materials Science, or a related field, with deep