APTD CEM Engineer: Die-Level Packaging & Innovation

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Micron Memory Malaysia Sdn Bhd is looking for an Engineer to join their Advanced Packaging Die Level Technology team in Singapore. You will focus on developing and optimizing assembly processes for advanced packaging technologies while collaborating with various internal and external stakeholders to enhance product quality and productivity.

Ideal candidates have an engineering degree, strong analytical skills, and are proficient in Python and SQL. Experience in the semiconductor industry is advantageous.

Qualifications

• Strong analytical, logical, and critical thinking skills required.
• Effective communication across all organizational levels.
• Experience in the semiconductor industry is a plus.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Collaborate with internal and external stakeholders.
• Conduct continuous data analysis to identify improvement opportunities.

Skills

Analytical skills

Collaboration

Python

SQL

Education

Bachelor’s or advanced degree in Engineering or Science

Tools

Visual Basic

Job description

Micron Memory Malaysia Sdn Bhd is looking for an Engineer to join their Advanced Packaging Die Level Technology team in Singapore. You will focus on developing and optimizing assembly processes for advanced packaging technologies while collaborating with various internal and external stakeholders to enhance product quality and productivity.

Ideal candidates have an engineering degree, strong analytical skills, and are proficient in Python and SQL. Experience in the semiconductor industry is advantageous.