Wafer-Level Packaging Engineer – APTD CEM

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

Micron Memory Malaysia Sdn Bhd is seeking an Engineer to join their Advanced Packaging Wafer Level Technology team in Singapore. The role involves enhancing wafer-level processes, collaborating with various teams, and evaluating new materials and equipment.

The ideal candidate holds a relevant degree and possesses strong analytical and communication skills. Experience in the semiconductor industry is preferred. Micron values innovation, collaboration, and a commitment to sustainability.

Qualifications

• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across all levels.
• Growth mindset with a passion for continuous learning.
• Demonstrated leadership and a track record of impact.

Responsibilities

• Establish and improve Wafer level process conditions and technologies.
• Evaluate and promote new equipment and materials.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Work closely with internal and external partners.

Skills

Analytical skills

Communication

Critical thinking

Collaboration

Proficiency in Python

Proficiency in R

Proficiency in SQL

Experience with Visual Basic

Education

Bachelor’s or advanced degree in Engineering or Science

Job description

Micron Memory Malaysia Sdn Bhd is seeking an Engineer to join their Advanced Packaging Wafer Level Technology team in Singapore. The role involves enhancing wafer-level processes, collaborating with various teams, and evaluating new materials and equipment.

The ideal candidate holds a relevant degree and possesses strong analytical and communication skills. Experience in the semiconductor industry is preferred. Micron values innovation, collaboration, and a commitment to sustainability.