Senior Bonding Process Engineer: Wafer Tech & Yield Champ

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology in Singapore seeks a Principal Engineer for Bonding Process & Equipment to lead development, qualification, and optimization of wafer bonding. You will drive yield improvements, cost reductions, and cross-functional collaboration across global sites to ensure process reliability and scalability.

The role requires strong expertise in bonding technologies and systematic problem solving, with experience in advanced packaging and semiconductor manufacturing.

Qualifications

• 7+ years in semiconductor manufacturing or advanced packaging.
• Strong knowledge of wafer-to-wafer bonding and related processes.
• Experience with DOE, FMEA, and SPC methodologies.

Responsibilities

• Develop, qualify, and optimize bonding process technologies such as hybrid/dielectric bonding.
• Lead yield improvement, cost reduction, and process capability initiatives.
• Collaborate with equipment engineering, suppliers, and global sites.

Skills

Bonding processes

Data analysis

DOE

FMEA

SPC

Education

Bachelor’s in Chemical Engineering

Master’s in Materials Science

PhD in Electrical Engineering

Tools

EVG

TEL

Disco platforms

Job description

Micron Technology in Singapore seeks a Principal Engineer for Bonding Process & Equipment to lead development, qualification, and optimization of wafer bonding. You will drive yield improvements, cost reductions, and cross-functional collaboration across global sites to ensure process reliability and scalability.

The role requires strong expertise in bonding technologies and systematic problem solving, with experience in advanced packaging and semiconductor manufacturing.