Associate Wire Bond Equipment Engineer – 12h Shifts

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 42,000 - 54,000; Full time

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a hands-on Associate Engineer to support setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

You will work on machine setup, qualification, and conversion, while minimizing downtime through effective troubleshooting. Responsibilities include preventive and corrective maintenance, monitoring performance, and conducting root cause analysis.

Qualifications

• Diploma in Electrical, Electronics, Mechanical or Mechatronics required.
• Hands-on maintenance and troubleshooting experience with wire bond equipment.
• Willingness to rotate between day and night shifts.

Responsibilities

• Perform machine setup, qualification, and conversion for wire bond equipment.
• Troubleshoot and repair equipment to minimize production downtime.
• Conduct preventive and corrective maintenance activities.
• Monitor equipment performance and implement improvements.
• Support production during breakdowns and urgent technical issues.
• Perform root cause analysis and corrective actions.
• Maintain equipment documentation and spare parts records.

Skills

Troubleshooting

Problem-solving

Shift adaptability

Education

Electrical/Electronics/Mechanical/Mechatronics Diploma

Tools

KNS Maxum

iConn

Rapid Bonder

Job description

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a hands-on Associate Engineer to support setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

You will work on machine setup, qualification, and conversion, while minimizing downtime through effective troubleshooting. Responsibilities include preventive and corrective maintenance, monitoring performance, and conducting root cause analysis.