Senior Wafer Bumping R&D Lead
UTAC HEADQUARTERS PTE. LTD.
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Job summary
UTAC HEADQUARTERS PTE. LTD. seeks a seasoned Technical Project Leader to drive cross-functional wafer bumping programs in Singapore.
You will ensure on-time, on-budget development from concept to pre-production, while collaborating with customers and suppliers. This role demands strong leadership, deep process knowledge (PVD, Lithography, Plating, Ball drop, WLCSP), and the ability to translate requirements into robust execution plans and data-driven decisions to boost the company’s
Qualifications
- Bachelor's degree in electronics, mechatronics, or related field.
- 10+ years in Wafer Bumping Process Development.
- Proficient in PVD, Lithography, Plating, Ball drop and WLCSP backend.
- Strong analytical and data analysis capabilities.
- Proven leadership in cross-functional projects.
Responsibilities
- Lead cross-functional teams to deliver wafer bumping programs.
- Oversee development from schedule to pre-production.
- Coordinate with customers and suppliers on processes and equipment.
- Provide technical guidance to enable technology offload and meet specs.
- Drive department goals and strategy with coaching and problem solving.
Skills
Education
Tools
Job description
UTAC HEADQUARTERS PTE. LTD. seeks a seasoned Technical Project Leader to drive cross-functional wafer bumping programs in Singapore.
You will ensure on-time, on-budget development from concept to pre-production, while collaborating with customers and suppliers. This role demands strong leadership, deep process knowledge (PVD, Lithography, Plating, Ball drop, WLCSP), and the ability to translate requirements into robust execution plans and data-driven decisions to boost the company’s
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