Senior Packaging Tech Lead: RF SiP & Wafer Integration

Qualcomm; Singapore; Sur place; SGD 180 000 - 240 000; Plein temps

Résumé du poste

RF360 Singapore Pte., Ltd. is seeking a senior technical specialist to own end-to-end packaging technology and product integration, including wafer pre‑assembly and Cu pillar bumping, within a global, cross‑functional team in Singapore.

You will drive development from wafer-level interconnect to package assembly, qualify advanced processes, and collaborate with OSATs to ensure robust, scalable RF front-end solutions for cellular and wireless markets.

Qualifications

• 10+ years in semiconductor packaging, RF modules preferred.
• Experience with wafer pre-assembly and Cu pillar bumping.
• Experience with wafer singulation (stealth/plasma) and die sort.
• Strong cross-functional leadership and travel willingness.

Responsabilités

• Lead as senior technical lead in global, cross-functional matrix.
• Develop and integrate Si and GaAs packaging processes from wafer to package.
• Qualify wafer singulation tech; own yield and reliability tradeoffs.
• Drive substrate and assembly solutions for RF SiP applications.
• Own end-to-end tech integration; risk assessment and release readiness.
• Develop packaging design rules aligned with manufacturing constraints.
• Interface to OSATs; lead tech transfer and new OSAT bring-up.
• Drive SPC, FMEA, PCN, change control, audits for ramp stability.
• Improve yield, quality, throughput, and reliability during ramp.
• Plan DOE to optimize bump, die sort, yield, and CPI.

Connaissances

Semiconductor packaging

Wafer pre-assembly

Wafer singulation

Cu pillar bumping

Stealth dicing

Plasma dicing

OSAT coordination

SPC analysis

Cross-functional leadership

International travel

Formation

Bachelor’s degree in engineering

Master’s degree in Engineering

PhD in Engineering

Outils

Test equipment

IPC/JEDEC standards

Statistical software

Description du poste

RF360 Singapore Pte., Ltd. is seeking a senior technical specialist to own end-to-end packaging technology and product integration, including wafer pre‑assembly and Cu pillar bumping, within a global, cross‑functional team in Singapore.

You will drive development from wafer-level interconnect to package assembly, qualify advanced processes, and collaborate with OSATs to ensure robust, scalable RF front-end solutions for cellular and wireless markets.