Senior Product Engineer, HBM Packaging & AI Impact

Micron Technology, Inc.; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

Micron Technology, Inc. is seeking a Senior Product Engineer for HBM packaging to drive yield, quality, and cost improvements across the packaging and test flows in Singapore.

You will work with Fab, Technology Development, and Packaging teams to optimize assembly processes, test coverage, and diagnostics, contributing to higher overall product reliability. The role emphasizes strong problem solving, data analysis, and collaboration across global teams, with on-site work in Singapore and

Qualifications

• Engineering degree required with 5+ years in semiconductors.
• Strong problem solving and root cause analysis.
• Experience in assembly processes or advanced packaging is preferred.

Responsibilities

• Improve ASM yield and DPM in manufacturing flows.
• Lead yield improvement initiatives across cross-functional teams.
• Debug failures via EFA/PFA and drive cross-functional resolution.

Skills

Problem solving

Statistical analysis

ML/AI experience

Cross-functional collaboration

Communication

Education

Bachelors/Masters in Electrical/Electronic/Mechanical Engineering

Tools

Python

Excel

Job description

Micron Technology, Inc. is seeking a Senior Product Engineer for HBM packaging to drive yield, quality, and cost improvements across the packaging and test flows in Singapore.

You will work with Fab, Technology Development, and Packaging teams to optimize assembly processes, test coverage, and diagnostics, contributing to higher overall product reliability. The role emphasizes strong problem solving, data analysis, and collaboration across global teams, with on-site work in Singapore and