HBM & NPI Packaging Engineer — AI-Driven Innovation

Micron Technology, Inc.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron Technology, Inc. is seeking Engineers to join the Package Development Engineering Team for Advanced Packaging in Singapore. This role supports next-generation memory and HBM packaging technologies, bridging development to high-volume manufacturing.

You will work with APDT and manufacturing partners, apply statistical methods from DOE, and contribute to risk assessments and technology transfer initiatives. A semiconductor background is highly valued.

Qualifications

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering or related discipline.
• Shift and weekend coverage as part of operations support.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator with ability to collaborate across levels.
• Internship or experience in the semiconductor industry is a plus.
• Interest in semiconductor industry and Micron preferred.
• Ability to apply AI literacy to use AI-enabled tools for research and analysis.

Responsibilities

• Integrate AI-assisted tools into daily work to improve efficiency, quality, and effectiveness.
• Apply DOE methods to accelerate learning through product qualifications.
• Partner with Advanced Package Technology Development and manufacturing teams for LVM and Run at Risk.
• Perform FMEA and implement control plans for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.

Skills

Analytical thinking

Effective communication

Growth mindset

Leadership

Collaboration

Education

Chemical Engineering

Materials Science

Electrical Engineering

Mechanical Engineering

Tools

MES systems

Automation

Python

JMP

Job description

Micron Technology, Inc. is seeking Engineers to join the Package Development Engineering Team for Advanced Packaging in Singapore. This role supports next-generation memory and HBM packaging technologies, bridging development to high-volume manufacturing.

You will work with APDT and manufacturing partners, apply statistical methods from DOE, and contribute to risk assessments and technology transfer initiatives. A semiconductor background is highly valued.