Senior Packaging Engineer - Die Stacking & Wafer Bonding

micron semiconductor asia operations pte. ltd.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd.

seeks a qualified engineer to push the development and deployment of assembly processes for advanced packaging technologies, ensuring performance, cost, manufacturability, quality, reliability, and schedule adherence. You will collaborate across multiple teams including Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality to integrate manufacturing processes for optimal performance and quality control, and to ensure

Qualifications

• PhD or Master's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Semiconductor process development or equipment evaluation experience.
• Experience with wafer bonding, die stacking and packaging is preferred.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Focus on improving product quality, yield, cost, and productivity.
• Establish and improve process management projects to meet technology node requirements.
• Provide POR and MOR documentation for product transfer to high-volume manufacturing.

Job description

Micron Semiconductor Asia Operations Pte. Ltd.

seeks a qualified engineer to push the development and deployment of assembly processes for advanced packaging technologies, ensuring performance, cost, manufacturability, quality, reliability, and schedule adherence. You will collaborate across multiple teams including Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality to integrate manufacturing processes for optimal performance and quality control, and to ensure