Principal, AI-Driven Advanced Packaging & Wafer Tech

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Semiconductor Asia Operations PTE. LTD. in Singapore seeks a senior engineer to develop and deploy post-fab wafer finishing processes for high-performance memory technologies.

You will coordinate with peers across organizations to launch new technologies and integration flows that drive performance, cost, manufacturability, quality and reliability. The role emphasizes collaboration with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product

Qualifications

• PhD/Master/Bachelor with extensive relevant experience in semiconductor process development.
• Experience in wafer bonding, plating, warpage control and packaging is preferred.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Establish and improve wafer-level process conditions (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Deliver technology node requirements and scaling for next node.

Skills

Python

R

SQL

Process modeling

Data analytics

Process flows

Education

PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

Tools

Visual Basic

E3

FDC

RMS

Job description

Micron Semiconductor Asia Operations PTE. LTD. in Singapore seeks a senior engineer to develop and deploy post-fab wafer finishing processes for high-performance memory technologies.

You will coordinate with peers across organizations to launch new technologies and integration flows that drive performance, cost, manufacturability, quality and reliability. The role emphasizes collaboration with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product