Senior Package Health Engineer — AI & Reliability

Micron Technology, Inc; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Technology, Inc. seeks a Staff/Senior Engineer to lead package health system analytics in Singapore. You will define health metrics, monitor dashboards, and perform real-time defect analysis across wafer, assembly, and test stages.

The role emphasizes end-to-end traceability and AI-driven improvements. The ideal candidate has 3+ years in semiconductors, strong data analytics, and experience with packaging processes, inline metrology, and advanced packaging technologies like 2.5D/3D

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
• 3+ years of experience in semiconductor industry with packaging/test/reliability focus.
• Strong data analytics and statistical modeling skills.
• Proficiency in Python/R for data analysis and visualization is a plus.
• Experience with AI/ML tools or statistical modeling.
• Understanding of semiconductor packaging processes and materials.
• Ability to work cross-functionally with process, equipment, and reliability teams.
• Knowledge of defect inspection systems and inline metrology.
• Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
• Strong problem-solving and documentation skills.

Responsibilities

• Define package health metrics and monitoring dashboards.
• Perform real-time defect detection and classification.
• Build and maintain a knowledge base for package health learnings.
• Develop data pipelines linking process parameters, equipment signals, and defect signatures.
• Integrate AI-assisted tools to improve efficiency and quality.

Skills

Data analytics

Python/R

AI/ML tools

Problem solving

Cross-functional collaboration

Defect inspection knowledge

Inline metrology knowledge

Education

Electrical Engineering or Materials Science degree

Tools

Python

R

AI/ML frameworks

Job description

Micron Technology, Inc. seeks a Staff/Senior Engineer to lead package health system analytics in Singapore. You will define health metrics, monitor dashboards, and perform real-time defect analysis across wafer, assembly, and test stages.

The role emphasizes end-to-end traceability and AI-driven improvements. The ideal candidate has 3+ years in semiconductors, strong data analytics, and experience with packaging processes, inline metrology, and advanced packaging technologies like 2.5D/3D