Staff Engineer: Package Health & AI Analytics

Micron; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. seeks a Package Health Analyst to advance monitoring, simulation, and characterization of semiconductor packages. You will perform hands‑on DFT data analysis, reliability testing, and contribute to AI‑assisted tooling to improve diagnostics.

The role emphasizes developing health metrics, defect characterization, and end‑to‑end traceability across wafer, assembly, and test stages, with cross‑functional collaboration across process and reliability teams.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
• 3+ years of experience in semiconductor industry, packaging, test, or reliability engineering.
• Strong data analytics and statistical modeling skills.
• Proficiency in Python/R for data analysis and visualization is a plus.
• Experience with AI/ML tools or statistical modeling.
• Strong understanding of semiconductor packaging process, material interaction and properties.
• Ability to work cross‑functionally with process, equipment, and reliability teams.
• Knowledge of defect inspection systems and inline metrology.
• Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
• Strong problem‑solving and documentation skills.
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Responsibilities

• Package Health Metrics & Monitoring: Define quantitative package health metrics and dashboards; perform electrical and mechanical characterization of packages.
• Inline Defect Characterization: Real‑time defect detection and classification; characterize critical defects and integrate findings into predictive models.
• Advanced Analytics & Knowledge Base: Correlate process variables with defect patterns and reliability; build a knowledge base for NPI handover.
• End-to-End Traceability: Establish traceability across wafer, assembly, and test; develop data pipelines linking process parameters, equipment signals, and defect signatures.
• AI Responsibilities: Integrate AI‑assisted tools to improve efficiency and quality; promote AI literacy and responsible use in research and operations.

Skills

Data analytics

Statistical modeling

Cross-functional collaboration

Problem-solving

AI literacy

Digital fluency

Education

Bachelor’s or Master’s in Electrical Engineering, Materials Science, or related field

Tools

Python

R

Data visualization tools

AI/ML tooling

Job description

Micron Technology, Inc. seeks a Package Health Analyst to advance monitoring, simulation, and characterization of semiconductor packages. You will perform hands‑on DFT data analysis, reliability testing, and contribute to AI‑assisted tooling to improve diagnostics.

The role emphasizes developing health metrics, defect characterization, and end‑to‑end traceability across wafer, assembly, and test stages, with cross‑functional collaboration across process and reliability teams.