Senior Engineer — Real-Time Metrology for Packaging

Micron Technology, Inc.

Singapore

Sur place

SGD 120 000 - 180 000

Plein temps

Il y a 2 jours

Soyez parmi les premiers à postuler

Une candidature complète en une minute

Un CV et une lettre de motivation personnalisés, prêts à envoyer.

Passez les filtres ATS

Résumé du poste

Micron Technology, Inc. in Singapore seeks a Senior Engineer in Advanced Package Metrology-Real-Time Defect Analysis to drive metrology recipe development, data analytics, and AI-enabled improvements for high-performance memory packaging.

You will work with peers across Packaging, Front End, and Quality teams to deliver reliable, efficient production metrics and continuous improvement. You will apply expertise in metrology and data analytics, leveraging tools like Power BI and AI-assisted

Qualifications

PhD or MS/BS with relevant experience in semiconductor engineering or related field.
Experience in wafer bonding, plating, warpage control and packaging is preferred.
Strong data analytics capabilities to support SPC, DOE and defect analysis.

Responsabilités

Develop and optimize metrology recipes for various semiconductor processes.
Identify, diagnose, and propose yield-related breakthroughs in advanced packaging.
Integrate AI-assisted tools and insights into metrology workflows for efficiency and quality.
Collaborate with cross-functional teams to implement new metrology and RDA technologies.
Establish equipment evaluation and long-range strategy to enable technology roadmaps.