Senior Package Health Engineer - Analytics & Reliability

Micron Technology, Inc.; Singapore; Sur place; SGD 90 000 - 140 000; Plein temps

Résumé du poste

Micron Technology, Inc. is seeking a Package Health Analyst in Singapore to develop and execute package health monitoring, simulation, and characterization activities. The role involves hands-on engineering in DFT, data analysis, and reliability testing to ensure robust packaging solutions.

You will work on metrics, inline defect characterization, and analytics to support end-to-end traceability. Collaboration with process, equipment, and reliability teams is essential for delivering

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
• 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
• Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus
• Strong understanding of semiconductor packaging processes, material interactions and properties.
• Ability to work cross-functionally with process, equipment, and reliability teams.
• Experience with AI/ML tools or statistical modeling is a plus.
• Knowledge of defect inspection systems and inline metrology.
• Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
• Strong problem-solving and documentation skills

Responsabilités

• Package Health Metrics & Monitoring
• Inline Defect Characterization
• Advanced Analytics & Knowledge Base
• End-to-End Traceability
• Collaborate with process, equipment and reliability teams

Connaissances

Data analytics

Statistical modeling

Cross-functional collaboration

Problem solving

Formation

Electrical Engineering / Materials Science degree

Outils

Python

R

Description du poste

Micron Technology, Inc. is seeking a Package Health Analyst in Singapore to develop and execute package health monitoring, simulation, and characterization activities. The role involves hands-on engineering in DFT, data analysis, and reliability testing to ensure robust packaging solutions.

You will work on metrics, inline defect characterization, and analytics to support end-to-end traceability. Collaboration with process, equipment, and reliability teams is essential for delivering