Senior/Principal Metrology Engineer — Advanced Packaging (AI)

Micron Technology, Inc.

Singapore

On-site

SGD 150,000 - 230,000

Full time

2 days ago

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Job summary

Micron Technology, Inc. in Singapore is seeking a Staff/Principal Engineer for Advanced Package Metrology-Real-Time Defect Analysis.

You will develop metrology recipes, establish inspection methods, and drive AI-enabled insights across cross-functional teams to improve yield and reliability. Ideal candidates have PhD or Master’s with several years in semiconductor packaging, strong analytics (Python/R/SQL), and experience with metrology systems and data dashboards.

Qualifications

PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in a related field.
Experience in semiconductor process or equipment engineering, preferably wafer bonding, plating, warpage control or packaging.
Strong skills in Python, R, SQL for analysis and modeling; familiarity with E3, FDC and RMS for control.

Responsibilities

Develop and optimize metrology recipes for semiconductor processes.
Establish inspection methodologies and BKM for metrology processes.
Perform in-line characterization and validation of metrology recipes.
Use Power BI to summarize metrology status and project progress.
Own metrology tools and drive performance indicators and SPC charts.
Collaborate with cross-functional teams to integrate new technologies; apply AI-enabled enhancements.