Senior Package Health Test Engineer (HBM/AI Focus)

Micron Technology, Inc; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

Micron Technology, Inc in Singapore is looking for a Package Health Test Engineer to contribute to the development and execution of package health monitoring and reliability testing. This role involves defining test coverage for wafer and die level processes and performing electrical characterization of advanced packages including HBM.

The ideal candidate will have a Bachelor's or Master's degree in Electrical Engineering, along with 2+ years of relevant experience in the semiconductor industry. Proficiency in AI/ML tools and scripting is highly valued.

Qualifications

• 2+ years of experience in semiconductor industry working on complex products.
• Experience defining test architectures and managing test/probe yield.
• Hands-on experience in package characterization and electrical failure analysis.

Responsibilities

• Develop advanced packaging technology strategies focused on test architecture.
• Perform electrical characterization and failure analysis of advanced packages.
• Co-drive customer test flow readiness activities with external partners.

Skills

Proficiency in AI/ML tools

Statistics

Data analysis

Scripting (e.g., Python)

Electrical characterization

Test architecture definition

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

Simulation tools

Test equipment

Job description

Micron Technology, Inc in Singapore is looking for a Package Health Test Engineer to contribute to the development and execution of package health monitoring and reliability testing. This role involves defining test coverage for wafer and die level processes and performing electrical characterization of advanced packages including HBM.

The ideal candidate will have a Bachelor's or Master's degree in Electrical Engineering, along with 2+ years of relevant experience in the semiconductor industry. Proficiency in AI/ML tools and scripting is highly valued.