Senior IC Packaging Design Engineer - Advanced Substrates

Advanced Substrate Technologies Pte Ltd (AST); Singapore; On-site; SGD 180,000 - 240,000; Full time

Benefits offered by this job

Competitive compensation and benefits

Opportunities for professional develop

Collaborative and innovative环境

Cutting-edge projects

Job summary

Advanced Substrate Technologies Pte. Ltd. (AST) seeks an experienced Package Architecture and Design Engineer to lead advanced packaging initiatives in Singapore.

You will co-design, optimize stacks, and ensure signal integrity, power integrity, and manufacturability in tight collaboration with multiple engineering teams. The role requires a strong background in IC packaging, proficiency with Cadence Allegro APD Release 25.1 and ANSYS tools, and a track record delivering NPI through high-volume

Qualifications

• BS/MS/PhD in Electrical Engineering (Preferred) or related field.
• Hands-on experience in advanced IC packaging for silicon nodes.
• Expertise in substrate design, SI/PI principles, thermal management, and high-speed IO packaging.
• Proficiency with Cadence Allegro APD Release 25.1/SIP or comparable packaging design tools.

Responsibilities

• Collaborate with Design, PCB Layout, Product Engineering, Process Engineering, Mechanical Engineering, and Manufacturing teams to optimize design performance.
• Co-optimize package stack-up, layer count, escape routing, BGA pattern, and power integrity architecture aligned to system and manufacturing requirements, using Cadence APD version Release 25.1
• Interpret SI/PI parameters (RL, IL, NEXT/FEXT, etc.) to drive signal integrity optimization.
• Provide design guidelines and recommendations to improve electrical performance and manufacturability.
• Review and monitor first article development results in collaboration with relevant divisions, focusing on high volume manufacturing.

Skills

Cross-functional leadership

Communication skills

Problem solving

Customer-facing skills

Education

BS/MS/PhD in Electrical Engineering or related

Tools

Cadence Allegro APD Release 25.1

ANSYS HFSS

ANSYS SI wave

ANSYS Mechanical (warpage)

Job description

Advanced Substrate Technologies Pte. Ltd. (AST) seeks an experienced Package Architecture and Design Engineer to lead advanced packaging initiatives in Singapore.

You will co-design, optimize stacks, and ensure signal integrity, power integrity, and manufacturability in tight collaboration with multiple engineering teams. The role requires a strong background in IC packaging, proficiency with Cadence Allegro APD Release 25.1 and ANSYS tools, and a track record delivering NPI through high-volume