Senior Principal Mechanical Engineer, Advanced Packaging

ASM; Singapore; On-site; SGD 90,000 - 135,000; Full time

Job summary

ASM is hiring engineers across experience levels for Advanced Packaging in Singapore. You'll work at the intersection of mechanical, electrical, and software domains to ensure our semiconductor equipment performs from concept to high-volume manufacturing.

This role offers hands-on challenges, mentorship, and clear growth pathways, with global collaboration and travel as needed. You will contribute to product lifecycle, NPI, and continuous improvement in demanding fab environments.

Qualifications

• Experience in semiconductor equipment or complex technical environments.
• System-level thinking and problem-solving mindset.
• Hands-on approach connecting theory to real-world behavior.
• Analytical skills including DOE and data analysis.
• Ability to work across global teams and time zones.
• Strong communication, including customer-facing interactions.

Responsibilities

• Design and develop semiconductor systems, including equipment selection and automation integration.
• Manage project timelines, budgets, and resources with safety and quality compliance.
• Collaborate with cross-functional teams across manufacturing, operations, and quality.
• Provide technical support and troubleshooting for equipment and automation.
• Own BOM release and maintain accurate documentation.
• Drive continuous improvement and stay current with industry trends.

Skills

Semiconductor experience

Problem solving

Hands-on

Analytical skills

Communication skills

Global collaboration

Travel readiness

Education

Bachelor's/Master's/PhD in Engineering

Job description

ASM is hiring engineers across experience levels for Advanced Packaging in Singapore. You'll work at the intersection of mechanical, electrical, and software domains to ensure our semiconductor equipment performs from concept to high-volume manufacturing.

This role offers hands-on challenges, mentorship, and clear growth pathways, with global collaboration and travel as needed. You will contribute to product lifecycle, NPI, and continuous improvement in demanding fab environments.