Advanced Packaging Design Engineer - AI-Driven, 2.5D/3D

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Advanced Micro Devices (S) Pte Ltd is seeking a highly experienced Package Design Engineer to drive end-to-end package design for complex products in a fast-paced, high-pressure environment. The role requires ownership across multiple programs and delivering high-quality designs with speed and precision.

You will develop substrate layouts, bump maps, and interposer designs for 2.5D/3D architectures, collaborate with SI/PI, mechanical, and SOC teams, and advance design methodologies using

Qualifications

• Experience designing complex substrate/Silicon Bridge/Interposers.
• Proven ability to execute in multi-project, fast-paced environments.
• Strong background in advanced packaging technologies.
• Hands-on experience with EDA tools.

Responsibilities

• Lead end-to-end package design execution for complex products, meeting performance, cost, quality, and schedule targets.
• Handle multiple concurrent design programs in a fast-paced environment.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging.
• Drive design decisions through collaboration with SI/PI, mechanical, and SOC teams.
• Interface with OSATs, foundries, and substrate vendors to optimize solutions.
• Mentor junior engineers and promote engineering excellence.

Skills

Ownership & accountability

AI/ML and automation

Cross-functional collaboration

Communication skills

Fast-paced execution

Education

Bachelor's or higher in Electrical/Computer Engineering

Job description

Advanced Micro Devices (S) Pte Ltd is seeking a highly experienced Package Design Engineer to drive end-to-end package design for complex products in a fast-paced, high-pressure environment. The role requires ownership across multiple programs and delivering high-quality designs with speed and precision.

You will develop substrate layouts, bump maps, and interposer designs for 2.5D/3D architectures, collaborate with SI/PI, mechanical, and SOC teams, and advance design methodologies using