Senior Simulation & Package Architecture Lead

Advanced Substrate Technologies Pte Ltd (AST); Singapore; On-site; SGD 150,000 - 210,000; Full time

Benefits offered by this job

Competitive compensation

Benefits

Professional development

Cutting-edge projects

Job summary

Advanced Substrate Technologies Pte. Ltd. (AST) Singapore-based subsidiary of TOPPAN Holdings Inc.

is hiring for a senior role focused on package architecture, co-design, and optimization of high-end FC-BGA substrates. You will perform SI/PI analysis for high-speed interfaces, work with cross-functional teams, and drive NPI through HVM. Ideal candidates have extensive IC packaging experience, proficiency with ANSYS HFSS and Cadence Allegro, and strong communication skills for delivering detailed

Qualifications

• Bachelor’s degree with 8+ years experience, or Master’s with 6+ years, or PhD with 3+ years.
• Electrical/Mechanical/Materials related field.
• Hands-on experience in advanced IC packaging for silicon nodes.
• Proven experience using simulation tools for complex engineering problems, SI/PI.
• Strong understanding of flip chip BGA packaging technology.

Responsibilities

• Perform SI and PI analysis for high-speed interfaces, packages, substrates, and PCB interconnects.
• Model and analyze high-speed channels including SI, PI, PDN modelling, and 3D electromagnetic simulation.
• Develop simulation models to validate data integrity and system robustness.
• Work closely with package design, layout, product engineering, and manufacturing teams to optimize design performance.
• Design simulation experiments (DoE) and communicate findings via reports and presentations.

Skills

ANSYS HFSS

ANSYS SI wave

ANSYS Mechanical

Cadence Allegro

Education

Electrical Engineering degree

Mechanical Engineering degree

Materials Science degree

Tools

HFSS

SI/PI

Job description

Advanced Substrate Technologies Pte. Ltd. (AST) Singapore-based subsidiary of TOPPAN Holdings Inc.

is hiring for a senior role focused on package architecture, co-design, and optimization of high-end FC-BGA substrates. You will perform SI/PI analysis for high-speed interfaces, work with cross-functional teams, and drive NPI through HVM. Ideal candidates have extensive IC packaging experience, proficiency with ANSYS HFSS and Cadence Allegro, and strong communication skills for delivering detailed