Senior Advanced Packaging R&D Engineer (5nm/3nm)

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

Singapore

On-site

SGD 120,000 - 190,000

Full time

3 days ago

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Job summary

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED in Singapore seeks a senior IC packaging engineer to drive package selection and design for next‑gen silicon nodes, collaborating with IC design, system, and thermal teams.

You will ensure CPI/SI/PI and thermal requirements are met, lead packaging from concept through high‑volume production, and define assembly BOMs, processes, and troubleshooting for advanced technologies such as 2.5D, 3DIC and beyond.

Qualifications

Educational degree in STEM fields required.
Experience with advanced packaging and CPI concepts.
Knowledge of 2.5D/3DIC, Si/Packaging integration.
Familiarity with GD&T and mechanical drawings.
Strong project management and leadership.
Ability to collaborate with cross-functional teams.

Responsibilities

Select optimum package solutions balancing cost, performance, manufacturability and reliability for new silicon nodes.
Design custom packages with IC design, system design, and thermal teams.
Ensure packages meet CPI/SI/PI and thermal requirements.
Research, develop, and productize new materials such as TIM and underfill for 5nm/3nm.
Manage packaging from concept to high volume production.
Create BOMs, processes, and troubleshoot packaging issues.
Collaborate with QA and customers to resolve quality issues.
Interface with suppliers for new product bring-up and ramp.
Support NPI bring-up, pkg qual, and sustain in production.