Senior FOAK Packaging Equipment Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 200,000; Full time

Job summary

Micron Technology in Singapore seeks a Senior or Staff Equipment Development Engineer to design and optimize next-generation wafer and die packaging equipment, from concept to deployment in manufacturing. You will enable process improvements, reduce costs, and drive equipment maturity and availability.

You will collaborate with process development, manufacturing, and vendors, develop hardware roadmaps for 5+ years, and apply failure analysis and data analytics to deliver robust, scalable

Qualifications

• 5+ years of semiconductor process or equipment engineering experience.
• Experience in wafer bonding, plating, warpage control and packaging field stacking equipment.
• Proficiency in Python, R, SQL for statistical analysis and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, RMS for equipment and process control.
• Strong data analytics capabilities for SPC and DOE.

Responsibilities

• Develop and optimize advanced packaging equipment for wafer-level packaging and stacking.
• Improve equipment capability, process improvements, reduce costs, and boost productivity.
• Lead equipment roadmaps for 5+ years in post-probe wafer and die processing.
• Collaborate with process development, manufacturing, and vendors to meet specifications.
• Integrate AI-assisted insights to improve efficiency, quality, and control.
• Guide transitions from development to high-volume production.

Skills

Python

R

SQL

Visual Basic

Data analytics

E3

FDC

RMS

Education

B.S./M.S./Ph.D. in Materials Science or Engineering

Tools

E3

FDC

RMS

Job description

Micron Technology in Singapore seeks a Senior or Staff Equipment Development Engineer to design and optimize next-generation wafer and die packaging equipment, from concept to deployment in manufacturing. You will enable process improvements, reduce costs, and drive equipment maturity and availability.

You will collaborate with process development, manufacturing, and vendors, develop hardware roadmaps for 5+ years, and apply failure analysis and data analytics to deliver robust, scalable