Senior/Staff FOAK Wafer & Die Packaging Equipment Engineer

Micron; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Senior or Staff Equipment Development Engineer to drive post probe wafer and die processing equipment development and optimization.

You will collaborate across process development, manufacturing, and vendors to ensure robust equipment and processes that meet Micron's stringent specifications. You will lead hardware roadmaps, work with AI-enabled analytics, and guide the transition from development to high-volume production, delivering

Qualifications

• 5+ years of semiconductor process or equipment engineering experience.
• Experience with wafer bonding, plating, warpage control and packaging field stacking equipment TC bonder/ Hybrid Bonder.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware.
• Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure.
• Knowledge of semiconductor processing, solid-state device physics desirable.
• Consistent track record to solve problems and address root causes.
• Ability to apply baseline digital fluency and AI literacy to use AI-enabled tools responsibly.

Responsibilities

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.
• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity.
• Establish and improve equipment management projects to deliver tech node requirements.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing.
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products; cost, availability, and improve hardware and process capability.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team.
• Good knowledge of Wafer Fab Manufacturing system, e.g., MES, ETO, Autoshell and E3 FDC is preferred.
• Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area.
• Collaborating with process development teams to develop innovative new solutions.
• Performing fundamental research to drive innovative solutions for next-generation equipment products.
• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
• Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
• Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Skills

Python

R

SQL

Visual Basic

AI literacy

Data analytics

Root cause analysis

Problem solving

Digital fluency

Education

B.S./M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics or related fields

Tools

E3

FDC

RMS

MES

Autoshell

Wafer bonding tooling

Job description

Micron Technology, Inc. in Singapore is seeking a Senior or Staff Equipment Development Engineer to drive post probe wafer and die processing equipment development and optimization.

You will collaborate across process development, manufacturing, and vendors to ensure robust equipment and processes that meet Micron's stringent specifications. You will lead hardware roadmaps, work with AI-enabled analytics, and guide the transition from development to high-volume production, delivering