Lead FAOK Wafer & Die Equipment Engineer

Micron Technology; Singapore; On-site; SGD 170,000 - 250,000; Full time

Job summary

Micron Technology is seeking a Senior or Staff Equipment Development Engineer to advance wafer and die packaging equipment. You will drive innovation from concept through hardware development, collaborate across process development, manufacturing, and vendors, and contribute to cost reduction and productivity gains.

You will apply data analytics, AI-enabled insights, and robust failure analysis to improve equipment maturity and process capability, in a collaborative, fast-paced environment.

Qualifications

• Proficiency in Python, R, SQL for statistical analysis and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.
• Improve equipment capability, process improvements, reduce costs and boost productivity.
• Establish hardware roadmaps for 5+ years in post probe wafer and die processing.
• Collaborate with cross-functional teams to integrate manufacturing processes for quality control.

Skills

Python

R

SQL

Visual Basic

Education

B.S./M.S./Ph.D. in Materials Science or related fields

Tools

AI/ML tooling

Job description

Micron Technology is seeking a Senior or Staff Equipment Development Engineer to advance wafer and die packaging equipment. You will drive innovation from concept through hardware development, collaborate across process development, manufacturing, and vendors, and contribute to cost reduction and productivity gains.

You will apply data analytics, AI-enabled insights, and robust failure analysis to improve equipment maturity and process capability, in a collaborative, fast-paced environment.