Senior Packaging Equipment Engineer, Advanced CEM

Micron Technology, Inc.; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineer for APTD CEM—Advanced Packaging Equipment Engineering. The role focuses on developing and optimizing wafer‑level packaging equipment, enabling process improvements and productivity gains.

You will work with multiple teams across packaging, wafer fab, and quality to ensure equipment meets performance and reliability targets. Strong analytical skills and experience in semiconductors are highly valued.

Qualifications

• Strong analytical, logical, and critical thinking skills.
• Effective communicator with collaboration across levels.
• Experience with statistical analysis and data analytics is a plus.

Responsibilities

• Develop and optimize Advanced Packaging Equipment for wafer‑level packaging and stacking.
• Collaborate with internal and external partners to execute technology development strategies.
• Establish hardware roadmaps and improve equipment management projects to meet technode requirements.

Skills

Analytical thinking

Communication

Python

R

SQL

Visual Basic for automation

Education

Bachelor’s or advanced degree in Engineering or Science

Tools

Visual Basic

Job description

Micron Technology, Inc. in Singapore is seeking an Engineer for APTD CEM—Advanced Packaging Equipment Engineering. The role focuses on developing and optimizing wafer‑level packaging equipment, enabling process improvements and productivity gains.

You will work with multiple teams across packaging, wafer fab, and quality to ensure equipment meets performance and reliability targets. Strong analytical skills and experience in semiconductors are highly valued.