Senior Engineer, Photonics Packaging & Assembly

POET TECHNOLOGIES PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

POET TECHNOLOGIES PTE. LTD. is seeking a Senior Engineer, Assembly to support R&D activities in Photonics IC Packaging. You will oversee machine setup, assembly, testing, and troubleshooting to ensure efficient operations and high quality in photonics packaging applications.

The role requires 5+ years in semiconductor, hands-on die-assembly tools, flip-chip bonders and wire bonders, with CAD familiarity as a plus. Collaborative cross-functional work is essential.

Qualifications

• Minimum 5 years of relevant semiconductor industry experience.
• Hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.

Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Skills

Semiconductor industry experience

Troubleshooting

Cross-functional collaboration

Education

Bachelor’s degree in Engineering

Tools

Die-assembly tools

Flip-chip bonders

Wire bonders

CAD drawing tools

Job description

POET TECHNOLOGIES PTE. LTD. is seeking a Senior Engineer, Assembly to support R&D activities in Photonics IC Packaging. You will oversee machine setup, assembly, testing, and troubleshooting to ensure efficient operations and high quality in photonics packaging applications.

The role requires 5+ years in semiconductor, hands-on die-assembly tools, flip-chip bonders and wire bonders, with CAD familiarity as a plus. Collaborative cross-functional work is essential.