Principal Process Engineer

TERAHOP PTE. LTD.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

TERAHOP PTE. LTD. in Singapore seeks an engineering leader to drive photonics packaging innovation.

The ideal candidate has deep expertise in advanced packaging design, cross-functional leadership, and hands-on development of fiber optic interconnect products. You will mentor teams, define test strategies, scale processes for high-volume production, and push for new materials and methods. Fluent in English and Chinese, you will collaborate with global partners to maintain Terahop's position at

Qualifications

• 10+ years of experience in advanced packaging design and process development.
• Experience in optical communication, high speed transceivers, MEMS, 2.5D/3D silicon photonics packaging and processes.
• Proficiency with packaging CAD tools and reliability testing.

Responsibilities

• Lead design, development and optimization of advanced photonics packaging solutions for fiber optic interconnect products.
• Collaborate with cross-functional teams from concept to production and manage suppliers to meet deliverables.
• Define test strategy, DFM, and prototype builds; analyze data to resolve design/process issues.
• Develop and optimize packaging processes (flip chip, wafer bonding, die attach, wire bonding, fiber alignment) and scale for high-volume production.
• Lead and mentor a high-performing engineering team and foster cross-functional collaboration.
• Stay abreast of photonics packaging advancements and contribute to patents, publications, and industry collaborations.

Skills

Leadership

Project management

Analytical skills

Communication

Interpersonal skills

Bilingual English/Chinese

Education

Bachelor's degree or higher in Electrical/Mechanical Engineering, Physics, or Materials Science

Tools

CAD software (SolidWorks, Zemax)

Job description

Work Summary:

We are seeking highly skilled and experienced engineering talents to join our Singapore R&D team as technical leaders for our advanced photonics packaging design and process development. The ideal candidate should have a deep understanding of photonics and semiconductor packaging technologies, extensive hands-on experiences in developing and implementing advanced packaging solutions. This role involves leading cross functional team in complex projects, mentoring junior team members, identifying and integrating emerging technologies and methodologies into product design and packaging processes, driving innovations in photonics packaging and new product development.

Key Responsibilities:

• Lead the design, development, and optimization of advanced photonics packaging solutions and processes for fiber optic interconnect products, including pluggable optical transceivers, advanced packaged optical interconnects, optical switching products etc.
• Work closely with cross functional team in product and technology development projects from concept to production, coordinate internal resources, manage corresponding suppliers and partners to ensure critical deliverables in schedule, performance, quality and manufacturability are met.
• Define test strategy, DFM matrix and requirements for new products and process development, manage prototypes and test vehicles builds. Analyze test data to identify and resolve design and process issues.
• Develop and optimize packaging processes, including flip chip and wafer bonding, die attach, wire bonding, and fiber alignment. Implement process control measures and continuous improvement initiatives to enhance manufacturing yield and product quality. Collaborate with manufacturing teams to scale processes for high-volume production.
• Develop, lead and grow a highly competent engineering team, mentor and provide technical guidance to junior engineers and cross-functional teams.
• Keep abreast of the latest advancements in photonics and packaging technologies through literature review, conferences, research and industry networking and collaborations. Conduct feasibility studies and research on new materials, processes, and packaging techniques. Contribute to patent filings, publications, and presentations to establish the company as a leader in photonics packaging.

Qualification:

• Bachelor or above in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or a related field.
• Minimum 10 years of experience in advanced packaging design and process development, with a proven track record of leading and delivering successful projects.
• Extensive knowledge in optical communication, high speed transceivers, integrated photonic devices, MEMS, precision flip chip bonding, 2.5D/3D silicon photonics packaging and processes, Co-packaged optics etc.
• Proficiency in CAD software for packaging design (Solidworks, Zemax etc).
• Knowledge of thermal management, stress analysis, and reliability testing in photonics packaging.
• Excellent problem-solving and analytical skills.
• Strong leadership, project management, and organizational skills.
• Effective communication and interpersonal skills, bilingual with both English and Chinese, with the ability to work with diverse teams and stakeholders.