Senior Assembly Engineer, Photonics Packaging

POET Technologies

Singapore

On-site

SGD 90,000 - 150,000

Full time

3 days ago

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Job summary

POET Technologies in Singapore is seeking a Senior Engineer, Assembly to drive advanced photonics IC packaging R&D. You will oversee machine setup, assembly, testing, troubleshooting, and continuous process improvement to ensure high yield and quality.

Collaboration with cross-functional teams is required to optimize manufacturing performance. The ideal candidate holds a degree in engineering and at least 5 years in semiconductor packaging, with hands-on experience in die-assembly tools,

Qualifications

Diploma or Bachelor's degree in Engineering or related field.
Minimum 5 years of experience in the semiconductor industry.
Hands-on experience with die-assembly tools, flip-chip bonders and wire bonders.
Familiarity with CAD drawing tools is advantageous.
Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.

Responsibilities

Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
Conduct testing on assembled devices and generate detailed test reports.
Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
Analyze packaging process performance, including yield, cost, specifications and cycle time.
Support continuous improvement initiatives to enhance manufacturing efficiency and product quality.
Maintain proper documentation of assembly procedures, testing results and activities.