Principal Engineer, R&D

STATS ChipPAC; Singapore; On-site; SGD 180,000 - 300,000; Full time

Job summary

STATSChipPac in Singapore seeks an experienced R&D Staff Engineer/Principal Engineer specializing in Silicon Photonics advanced packaging to realize next-generation optical interconnects for high-volume manufacturing. You will lead packaging tech development with universities and research institutes, driving Si photonics/chiplet packaging and co-packaged optics toward scalable production.

You will report to the Vice President of R&D and apply advanced packaging technologies, program management,

Qualifications

• Advanced packaging and optics fundamentals.
• 10+ years in semiconductor with 5+ years in technical/project management.
• Wafer-level processing and interconnection assembly experience.

Responsibilities

• Lead packaging technology development with universities/research institutes.
• Define assembly baseline processes and BOM; establish design/manufacturing for performance, reliability, yield and cost.
• Collaborate with customers, vendors and research institutes to bring packaging solutions from concept to HVM.
• Research and create new technologies for emerging frontiers.
• Drive new technologies for timely new product introduction and ramping of new technologies.
• Support project management and document technical findings through reports or presentations.

Skills

Optics & Photonics

Device/Module integration

Fiber-coupled testing

Cross-functional teamwork

Project management

Wafer-level packaging

Laboratory measurement

Education

MS/PhD in Physics (Optics) / Materials / Mechanical / Chemical / Electrical Engineering

Tools

CMP

TSV

CoWoS/CoPoS

Optical simulation software

Job description

STATSChipPac is seeking a passionate R&D Staff Engineer/Principal Engineer, with experience in Silicon Photonics advanced packaging, to realize next-generation optical interconnects for high-volume manufacturing. The candidate will join the Singapore R&D team and lead the packaging technologies development with universities and research institutes. The candidate will drive and bring Si photonics/chiplet packaging and co-package optics development, utilizing advanced packaging technologies, to scalable production. The development covers high efficient optical I/O module architecture, assembly, optical coupling design, materials and process for fiber packaging.

The candidate will report to the Vice President of R&D. The successful candidate will have demonstrated advanced packaging technologies expertise, program management, excellent communication skills, and ability to apply process-control and problem-solving methodologies to achieve business objectives.

Responsibilities

• Responsible to lead packaging technology development and projects with universities/research institutes.
• Collaborate with cross-functional teams to enable scalable, manufacturable designs - define assembly baseline processes, decide package BOM, establish design/manufacturing (eg. optical coupling) that are optimized for performance, reliability, yield and cost.
• Work with customers, vendors and research institutes to bring packaging solution from concept to HVM.
• Research and create new technologies for emerging frontiers.
• Drive new technologies development for timely new product introduction and ramping of new technologies.
• Support project management and technical findings documentation through reports, reviews, or relevant forum presentations

Qualifications

• Strong theoretical background in optics and photonics fundamentals, device/module integration.
• Hands-on experience in packaging and measuring fiber-coupled devices, preferably has hands-on experience in optical component design, simulation and qualification, and fiber assembly.
• M.S. or Ph.D. in Physics (Optics major), Material Science, Mechanical, Chemical or Electrical Engineering or related field.
• Minimum of 10 years of experience in semiconductor industry, including at least 5 years of experience in technical and/or project management.
• Familiar with wafer-level processing and packaging (such as CMP, TSV, CoW, advanced singulation) and interconnection assembly (such as hybrid bonding, CoWoS, CoPoS)
• Experience in designing test vehicle for reliability and performance assessment. Capable to troubleshoot and analyze the physics of failure.
• Strong cross-functional teamwork, collaboration, interpersonal, written and business skills. Good communication skills