Senior Engineer, Assembly

POET TECHNOLOGIES PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

POET TECHNOLOGIES PTE. LTD. is seeking a Senior Engineer, Assembly to support R&D activities in Photonics IC Packaging. You will oversee machine setup, assembly, testing, and troubleshooting to ensure efficient operations and high quality in photonics packaging applications.

The role requires 5+ years in semiconductor, hands-on die-assembly tools, flip-chip bonders and wire bonders, with CAD familiarity as a plus. Collaborative cross-functional work is essential.

Qualifications

• Minimum 5 years of relevant semiconductor industry experience.
• Hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.

Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Skills

Semiconductor industry experience

Troubleshooting

Cross-functional collaboration

Education

Bachelor’s degree in Engineering

Tools

Die-assembly tools

Flip-chip bonders

Wire bonders

CAD drawing tools

Job description

Position Summary

We are seeking a highly motivated Senior Engineer, Assembly to support research and development activities in Photonics IC Packaging. The role involves machine setup, assembly, testing, troubleshooting, and process improvement for advanced photonics packaging applications. The successful candidate will work closely with cross-functional teams to ensure efficient assembly operations, quality performance, and continuous process optimization.

Key Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Requirements

• Diploma, Advanced/Higher/Graduate Diploma, or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 5 years of relevant working experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders is strongly preferred.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.