Senior Photonics Packaging Engineer - R&D & Process Dev

InnoLight Technology

Singapore

On-site

SGD 180,000 - 260,000

Full time

14 days+

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Job summary

InnoLight Technology in Singapore is seeking a highly skilled engineering leader to drive photonics packaging design and process development. You will lead cross-functional teams, mentor engineers, and push innovative packaging solutions for fiber optic interconnect products and related technologies.

The role requires deep photonics knowledge, 10+ years in advanced packaging, and strong leadership across projects from concept to production.

Qualifications

Bachelor's or above in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or related field.
Minimum 10 years of experience in advanced packaging design and process development, with a proven track record of leading and delivering successful projects.
Extensive knowledge in optical communication, high-speed transceivers, integrated photonic devices, MEMS, precision flip-chip bonding, 2.5D/3D silicon photonics packaging and processes, and Co-packaged optics.
Proficiency in CAD software for packaging design (Solidworks, Zemax, etc.).
Knowledge of thermal management, stress analysis, and reliability testing in photonics packaging.
Excellent problem-solving and analytical skills.
Strong leadership, project management, and organizational skills.
Bilingual with English and Chinese.

Responsibilities

Lead the design, development, and optimization of advanced photonics packaging solutions and processes for fiber optic interconnect products, including pluggable optical transceivers, advanced packaged optical interconnects, optical switching products, etc.
Work closely with cross-functional teams in product and technology development projects from concept to production, coordinate internal resources, manage suppliers and partners to ensure deliverables in schedule, performance, quality, and manufacturability.
Define test strategy, DFM matrix, and requirements for new products and process development, manage prototypes and test vehicle builds. Analyze test data to identify and resolve design and process issues.
Develop and optimize packaging processes, including flip chip and wafer bonding, die attach, wire bonding, and fiber alignment. Implement process control measures and continuous improvement initiatives to enhance manufacturing yield and product quality.
Develop, lead, and grow a highly competent engineering team, mentor, and provide technical guidance to junior engineers and cross-functional teams.
Keep abreast of the latest advancements in photonics and packaging technologies through literature reviews, conferences, research, and industry networking and collaborations. Conduct feasibility studies and research on new materials, processes, and packaging techniques. Contribute to patent filings, publications, and presentations to establish the company as a leader in photonics packaging.