Senior Engineer, Assembly

POET Technologies; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

POET Technologies in Singapore is seeking a Senior Engineer, Assembly to drive advanced photonics IC packaging R&D. You will oversee machine setup, assembly, testing, troubleshooting, and continuous process improvement to ensure high yield and quality.

Collaboration with cross-functional teams is required to optimize manufacturing performance. The ideal candidate holds a degree in engineering and at least 5 years in semiconductor packaging, with hands-on experience in die-assembly tools,

Qualifications

• Diploma or Bachelor's degree in Engineering or related field.
• Minimum 5 years of experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders and wire bonders.
• Familiarity with CAD drawing tools is advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.

Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, cost, specifications and cycle time.
• Support continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results and activities.

Skills

Die-assembly tools

Flip-chip bonders

Wire bonders

Semiconductor wafer packaging

Education

Diploma or Bachelor's in Engineering

Bachelor's Degree in Engineering or related field

Tools

CAD drawing tools

Job description

We are seeking a highly motivated Senior Engineer, Assembly to support research and development activities in Photonics IC Packaging. The role involves machine setup, assembly, testing, troubleshooting, and process improvement for advanced photonics packaging applications. The successful candidate will work closely with cross-functional teams to ensure efficient assembly operations, quality performance, and continuous process optimization.

Key Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Requirements

• Diploma, Advanced/Higher/Graduate Diploma, or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 5 years of relevant working experience in the semiconductor industry.
• Hands‑on experience with die‑assembly tools, flip‑chip bonders, and wire bonders is strongly preferred.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.