Process Development Engineer

InnoLight Technology; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

InnoLight Technology in Singapore is seeking a highly skilled engineering leader to drive photonics packaging design and process development. You will lead cross-functional teams, mentor engineers, and push innovative packaging solutions for fiber optic interconnect products and related technologies.

The role requires deep photonics knowledge, 10+ years in advanced packaging, and strong leadership across projects from concept to production.

Qualifications

• Bachelor's or above in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or related field.
• Minimum 10 years of experience in advanced packaging design and process development, with a proven track record of leading and delivering successful projects.
• Extensive knowledge in optical communication, high-speed transceivers, integrated photonic devices, MEMS, precision flip-chip bonding, 2.5D/3D silicon photonics packaging and processes, and Co-packaged optics.
• Proficiency in CAD software for packaging design (Solidworks, Zemax, etc.).
• Knowledge of thermal management, stress analysis, and reliability testing in photonics packaging.
• Excellent problem-solving and analytical skills.
• Strong leadership, project management, and organizational skills.
• Bilingual with English and Chinese.

Responsibilities

• Lead the design, development, and optimization of advanced photonics packaging solutions and processes for fiber optic interconnect products, including pluggable optical transceivers, advanced packaged optical interconnects, optical switching products, etc.
• Work closely with cross-functional teams in product and technology development projects from concept to production, coordinate internal resources, manage suppliers and partners to ensure deliverables in schedule, performance, quality, and manufacturability.
• Define test strategy, DFM matrix, and requirements for new products and process development, manage prototypes and test vehicle builds. Analyze test data to identify and resolve design and process issues.
• Develop and optimize packaging processes, including flip chip and wafer bonding, die attach, wire bonding, and fiber alignment. Implement process control measures and continuous improvement initiatives to enhance manufacturing yield and product quality.
• Develop, lead, and grow a highly competent engineering team, mentor, and provide technical guidance to junior engineers and cross-functional teams.
• Keep abreast of the latest advancements in photonics and packaging technologies through literature reviews, conferences, research, and industry networking and collaborations. Conduct feasibility studies and research on new materials, processes, and packaging techniques. Contribute to patent filings, publications, and presentations to establish the company as a leader in photonics packaging.

Skills

Leadership

Project management

Analytical skills

Communication

Bilingual English/Chinese

Photonics packaging expertise

Education

Bachelor's degree or above in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or related field

Tools

SolidWorks

Zemax

Job description

We are seeking highly skilled and experienced engineering talents to join our Singapore R&D team as technical leaders for our advanced photonics packaging design and process development. The ideal candidate should have a deep understanding of photonics and semiconductor packaging technologies, and extensive hands-on experience in developing and implementing advanced packaging solutions. This role involves leading cross-functional teams in complex projects, mentoring junior team members, identifying and integrating emerging technologies and methodologies into product design and packaging processes, and driving innovations in photonics packaging and new product development.

Key Responsibilities:

• Lead the design, development, and optimization of advanced photonics packaging solutions and processes for fiber optic interconnect products, including pluggable optical transceivers, advanced packaged optical interconnects, optical switching products, etc.
• Work closely with cross-functional teams in product and technology development projects from concept to production, coordinate internal resources, manage corresponding suppliers and partners to ensure critical deliverables in schedule, performance, quality, and manufacturability are met.
• Define test strategy, DFM matrix, and requirements for new products and process development, manage prototypes and test vehicle builds. Analyze test data to identify and resolve design and process issues.
• Develop and optimize packaging processes, including flip chip and wafer bonding, die attach, wire bonding, and fiber alignment. Implement process control measures and continuous improvement initiatives to enhance manufacturing yield and product quality. Collaborate with manufacturing teams to scale processes for high-volume production.
• Develop, lead, and grow a highly competent engineering team, mentor, and provide technical guidance to junior engineers and cross-functional teams.
• Keep abreast of the latest advancements in photonics and packaging technologies through literature reviews, conferences, research, and industry networking and collaborations. Conduct feasibility studies and research on new materials, processes, and packaging techniques. Contribute to patent filings, publications, and presentations to establish the company as a leader in photonics packaging.

Qualification:

• Bachelor's or above in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or a related field.
• Minimum 10 years of experience in advanced packaging design and process development, with a proven track record of leading and delivering successful projects.
• Extensive knowledge in optical communication, high-speed transceivers, integrated photonic devices, MEMS, precision flip-chip bonding, 2.5D/3D silicon photonics packaging and processes, and Co-packaged optics.
• Proficiency in CAD software for packaging design (Solidworks, Zemax, etc.).
• Knowledge of thermal management, stress analysis, and reliability testing in photonics packaging.
• Excellent problem-solving and analytical skills.
• Strong leadership, project management, and organizational skills.
• Effective communication and interpersonal skills, bilingual with both English and Chinese, with the ability to work with diverse teams and stakeholders.