Senior Engineer, APTD CEM - Advanced Packaging Die-Level Tech

WhiteCrow Research; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

WhiteCrow Research seeks a Senior Engineer, APTD CEM, to advance assembly processes for wafer-level packaging, CoW, and die stacking at our Singapore site. You will drive quality, yield, and cost improvements and lead projects across packaging, FAB, and quality teams.

Required: a technical degree and 2+ years in semiconductor process development, plus strong Python, R, SQL skills and data analytics expertise.

Qualifications

• Degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical discipline.
• 2+ years of semiconductor process development or equipment evaluation experience (wafer bonding, die stacking, or advanced packaging).
• Proficiency in Python, R, and SQL.
• Experience with Visual Basic for automation and tool integration.
• Knowledge of E3, FDC, and RMS.
• Strong data analytics capability supporting SPC, DOE, defect analysis, and dashboards.
• Strong understanding of semiconductor process flows, yield, performance, and reliability.
• Strong problem-solving and root-cause analysis skills.
• Ability to work under aggressive timelines and limited resources.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies (wafer-level packaging, CoW, C2W).
• Improve product quality, yield, productivity, and manufacturing cost.
• Drive process management projects for future technology nodes.
• Evaluate, qualify, and implement new equipment and materials.
• Establish process parameters for semiconductor manufacturing equipment.
• Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.
• Use data analytics to establish advanced process controls and identify improvement opportunities.
• Collaborate with Package Integration, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams.
• Support transition from product development through qualification into High Volume Manufacturing (HVM).
• Provide Process of Record (POR) and Model of Record (MOR) documentation.

Skills

Python

R

SQL

Education

B.S./M.S./Ph.D. in Materials Science or related technical field

Tools

Visual Basic

Job description

WhiteCrow Research seeks a Senior Engineer, APTD CEM, to advance assembly processes for wafer-level packaging, CoW, and die stacking at our Singapore site. You will drive quality, yield, and cost improvements and lead projects across packaging, FAB, and quality teams.

Required: a technical degree and 2+ years in semiconductor process development, plus strong Python, R, SQL skills and data analytics expertise.